SPEEDLINE TECHNOLOGIES, INC.

BRIDGEVISION

machines for deposition of solder and other electronic materials on printed circuit boards, namely, screen printers equipped with optical sensor system for detection of solder bridging;BRIDGE VISION;

CAM/ALOT BENCHMARK

COMPUTER SOFTWARE TO CONTROL MACHINERY USED IN THE ELECTRONICS ASSEMBLY INDUSTRY FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC COMPONENTS;BENCHMARK;

CAMALOT PULSE-JET

electronic liquid dispensing system comprising automated dispensing machines for precise dispensing and placement of industrial materials, such as solder pastes, adhesives, epoxies and other fluid materials used in electronics assembly, industrial and automotive applications;CAMALOT PULSE JET;

COOL CLEAN

ELECTRIC POWERED THERMAL PROCESSING APPARATUS FOR SOLDERING, DRYING AND CURING OF CIRCUIT BOARDS HAVING ADHESIVES, POLYMERS AND/OR SOLDER THEREON;

ELECTRO SOFT

COMPUTER PROGRAMS AND INSTRUCTION MANUALS SOLD THEREWITH FOR USE IN SUPPLEMENTING THE OPERATION OF COMPUTER/MICROPROCESSOR CONTROLLED MACHINES FOR ELECTRONIC ASSEMBLY AND PROCESSING;

FLUX EXTRACTION SYSTEM

thermal processing apparatus for soldering, drying and curing of circuit boards having adhesives, polymers and/or solder thereon;

HOT-TRAC

thermal processing machines used in preheating printed circuit boards and other electronic components used in the manufacture of electronic assemblies;HOT TRACK;

MICROPRO

MICRO PRO;Industrial heaters and drying units for heating and reflowing solder and related electronic materials and cleansing printed circuit boards and other electronic substrates;

PULSE-JET

electronic liquid dispensing system comprising automated dispensing machines for precise dispensing and placement of industrial materials, such as solder pastes, adhesives, epoxies and other fluid materials used in electronics assembly, industrial and automotive applications;PULSE JET;

QUICKCLICK

Fluid dispensing pumps and fluid dispensing machines for use in the field of printed circuit board assembly, electronics component assembly and electronics packaging assembly;

SPEEDLINE

MATERIALS TREATMENT SERVICES IN ELECTRONIC PRODUCTION PROCESSES, NAMELY, APPLICATION OF SOLDER PASTES AND ADHESIVES TO PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC COMPONENTS;SPEED LINE;

SPEEDLINE

printed circuits and printed circuit boards;

UP3000 ULTRAFLEX

stencil printing machines for application of solder, adhesives and other materials to printed circuit boards and other electronic substrates used in the manufacture of electronic assemblies;UP 3000 ULTRA FLEX;

VARICOOL

Automated equipment for thermal processing of circuit boards, namely, thermal processing apparatus for soldering, drying and curing of circuit boards having adhesives, polymers and/or solder thereon.;

XYFLEXPRO

liquid measuring dispensers for dispensing materials in the electronics industries;modular-style liquid dispensing systems comprising a dispensing pump, controllers for the pump, and a dispensing head, for dispensing materials in the electronics industries;