THERMAL PROCESSING APPARATUS SOLDERING

Brand Owner (click to sort) Address Description
FLUX EXTRACTION SYSTEM SPEEDLINE TECHNOLOGIES, INC. 16 Forge Park Franklin MA 02038 thermal processing apparatus for soldering, drying and curing of circuit boards having adhesives, polymers and/or solder thereon;
INFRAFLO ELECTROVERT LTD. thermal processing apparatus for soldering, drying and curing of circuit boards having adhesives, polymers and/or solder thereon;Infra-Flow;
OMNIEXCEL Illinois Tool Works Inc. 155 Harlem Avenue Glenview IL 60025 Thermal processing apparatus for soldering, drying and curing of circuit boards having adhesives, polymers and/or solder thereon;
OMNIFLO Illinois Tool Works Inc. 155 Harlem Avenue Glenview IL 60025 thermal processing apparatus for soldering, drying and curing of circuit boards having adhesives, polymers and/or solder thereon;OMNIFLOW;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks. Soldering the leads during the annealing or laminating process eliminated possible thermal damage to the sheet by having the sheet heated during the soldering operation instead of only a small surface portion of the sheet at and eliminates the cost of a separated soldering operation.