SOITEC

CONCENTRIX

Devices and apparatus for producing electricity with solar panels or cells; devices and apparatus with solar panels or cells for producing power; solar cells for producing power; solar panels for producing electricity; photovoltaic installations for the production of solar energy; solar batteries; solar batteries for household use; solar batteries for industrial use; photovoltaic equipment for producing electricity and installations comprised thereof; converters for photovoltaic devices;

CONCENTRIX SOLAR

[ Production of solar power ];Electric solar cells;CONCENTRIC SOLAR;SOLAR;[ Design of photo-voltaic modules and systems and photo-voltaic power plants ];

CONCENTRIX SOLAR

Generation of solar electricity;Solar cells also including light collecting devices and appliances for electricity generation sold as a unit; solar cells also including light collecting devices and appliances for power generation sold as a unit; solar cells for electricity generation; solar modules for production of electricity; photovoltaic solar power plants for electricity generation; solar batteries; solar batteries for households; solar batteries for industrial purposes; photovoltaic devices for electricity generation and plants, namely, solar cells, photovoltaic cells and modules; power inverters for photovoltaic applications;Semicircles of the graphic element and word solar are blue; center-point of the semicircles and the word Concentrix are black.;CONCENTRICS SOLAR;The color(s) blue and black is/are claimed as a feature of the mark.;SOLAR;Services of developments for photovoltaic applications, namely, design and development of new products and photovoltaic power plants for others; development of new technology in the field of photovoltaic applications; development of photovoltaic modules and systems; development of photovoltaic power plants;

ESI

semi-conductor wafers; semi-conductors; semiconductor wafers, particularly silicon wafers, for printed circuits, integrated circuits and electronics manufacturing; semiconductor wafers for radio frequency (RF) components and for power components; semiconductor components for microelectronics and micro-engineering; semiconductor wafers for use in microelectronics, power electronics and micro-engineering, for flat screens, for integrated optical waveguides, for sensors, particularly image sensors, for memory cards and microprocessors, for magnetic identity cards;

GANOTEC

TREATMENT OF MATERIALS, NAMELY, MECHANICAL, CHEMICAL AND PHYSICAL TREATMENT AND MATERIAL SURFACE MACHINING OF SEMICONDUCTOR SUBSTRATES FOR MICROELECTRONICS AND OPTOELECTRONICS AND ALL DERIVED ACTIVITIES, AND OF SEMICONDUCTOR WAFERS AND SEMICONDUCTORS, POLISHING SEMICONDUCTOR WAFERS, TRANSFER OF SILICON, SEMICONDUCTOR OR COMPONENT LAYERS ON ALL MEDIA;MULTISTACK AND BULK SEMICONDUCTOR WAFERS MADE OF ELEMENTS IN COLUMNS III AND V OF MENDELEEV'S PERIODIC TABLE; SEMICONDUCTORS; MULTISTACK AND BULK SEMICONDUCTOR WAFERS MADE OF ELEMENTS IN COLUMNS III AND V OF MENDELEEV'S PERIODIC TABLE, FOR LIGHT-EMITTING DIODES AND FOR HIGH-POWER RADIO FREQUENCY (RF) COMPONENTS; COMPONENTS FOR MICROELECTRONICS, OPTOELECTRONICS AND MICRO-ENGINEERING, NAMELY, MULTISTACK AND BULK SEMICONDUCTOR WAFERS OF GALLIUM NITRIDE AND OF OTHER SEMICONDUCTOR MATERIALS, INCLUDING ELEMENTS IN COLUMNS III AND V OF MENDELEEV'S PERIODIC TABLE; SEMICONDUCTOR MATERIAL SUBSTRATES FOR MICROELECTRONICS, OPTOELECTRONICS AND FOR MICRO-ENGINEERING, FOR FLAT PANEL DISPLAYS, FOR LIGHT-EMITTING DIODES, INTEGRATED OPTICAL GUIDES, FOR SENSORS, FOR MEMORY CARDS OR CHIP CARDS, AND FOR HIGH-POWER RADIO FREQUENCY (RF) COMPONENTS; SEMICONDUCTOR SUBSTRATES FOR USE IN OPTOELECTRONICS, MICROELECTRONICS, MICRO-ENGINEERING, AND DERIVED ACTIVITIES THERETO;Color is not claimed as a feature of the mark.;SCIENTIFIC, TECHNOLOGICAL, TECHNICAL AND INDUSTRIAL RESEARCH IN THE FIELD OF SEMICONDUCTORS; MATERIALS TESTING AND LABORATORY WORK FOR THIRD PARTIES IN THE FIELD OF SEMICONDUCTORS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR THIRD PARTIES; NEW PRODUCT RESEARCH AND DEVELOPMENT FOR OTHERS IN THE FIELD OF WAFERS AND SEMICONDUCTORS FOR OPTOELECTRONIC COMPONENTS, HIGH-POWERED RADIO-FREQUENCY (RF) RADIO COMPONENTS AND DERIVED ACTIVITIES; ENGINEERING AND SERVICES OF ENGINEERS, NAMELY, ENGINEERING SERVICES FOR OTHERS IN THE FIELD OF SEMICONDUCTOR WAFERS AND SEMICONDUCTORS FOR OPTOELECTRONIC COMPONENTS, FOR HIGH-POWER RADIO-FREQUENCY (RF) COMPONENTS AND DERIVED ACTIVITIES;

SMART CUT

In the statement, Column 1, Line 2, S.A. is deleted.;[ SCIENTIFIC, LABORATORY AND INDUSTRIAL RESEARCH SERVICES, CONSULTING SERVICES, ] ENGINEERING SERVICES, [ EVALUATION AND TESTING SERVICES, ] ALL IN THE FIELDS OF MANUFACTURE OF INTEGRATED CIRCUITS AND SILICON WAFERS AND MICROELECTRONICS COMPONENTS USED FOR THE MANUFACTURE OF INTEGRATED CIRCUITS;

SMART CUT

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF MECHANICAL, PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, IONS, IMPLANTATION, CHEMICAL TREATMENT, CHEMICAL-MECHANICAL-POLISHING TREATMENT AND ALL TREATMENTS USED IN THE SEMICONDUCTOR INDUSTRY;In the statement, line 1 S.A. is deleted.;

SMART STACKING

Processing of base materials for microelectronics, optoelectronics, photovoltaics and micromechanics and all derived activities, namely, silicon wafer bonding treatment, silicon wafer thinning treatment, silicon wafer edge removal treatment, silicon wafer etching treatment and integrated circuits etching treatment of semiconductor silicon wafers for micro-electronics, opto-electronics, photovoltaics and micro-mechanical engineering; processing of wafers of microelectronic components through bonding, for stacked microelectronic structures, namely, treatment of components of silicon wafers for micro-electronics by bonding in order to form stacked micro-electronics structures;[ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, for flat screens, for integrated optical wave guides, for sensors, for imaging devices, and for micro-machining; semiconductor wafers for micro-electronics, for flat screens, for integrated optical wave guides for sensors, for imaging devices, and for micro-machining; silicon wafers, silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, opto-electronics, photovoltaics and micro-mechanical engineering ];Color is not claimed as a feature of the mark.;STACKING;[ Research and development of new products for others; research for others in the field of microelectronics; ] engineering services; technical consulting in the field of microelectronics; material testing; [ laboratory research in the field of micro-electronics ];

SMARTCELL

Solar electricity production; solar energy production;Light collection devices and apparatus using solar cells for electricity and energy production, namely, photovoltaic cells also including a solar thermal collector sold as a unit; solar cells and photovoltaic modules for electricity production; photovoltaic devices for electricity production, namely, photovoltaic cladding panels, photovoltaic roofing members, photovoltaic solar modules, photovoltaic solar hybrid modules, photovoltaic thermal module, photovoltaic thermal hybrid module, electronic device for monitoring and optimizing photovoltaic arrays, photovoltaic cells and modules, photovoltaic inverters; photovoltaic installation apparatus and photovoltaic electrical plants and parts thereof, namely, solar modules for production of electricity, solar thermal and electric receivers, tracking mechanisms and concentrating optics, and control algorithms; inverters for photovoltaic installations and applications; solar cells for household and industrial use; solar cells or photovoltaic modules being apparatus and instruments for energy production; solar collection apparatus and instruments using solar cells for solar energy production, namely, photovoltaic cells also including a solar thermal collector sold as a unit; solar cells and photovoltaic modules for electricity production;SMART CELL;Silicon and semiconductor materials, namely, chemical compounds in the nature of Gallium arsenide, Indium phosphide, Indium gallium arsenide, Indium gallium arsenide phosphide, for the production of enzyme substrates in the field of microelectronics;Research and development in the field of photovoltaic energy, photovoltaic applications, photovoltaic modules, systems and power plants; engineering services, namely, evaluation, analysis and research in the fields of science and technology provided by engineers; industrial analysis and scientific and technological research work in the field of thermal, photovoltaic, and wind solar energy, design and development of photovoltaic solar systems and modules; research and development activity carried out by a chemical laboratory; technological consulting services in the field of alternative energy generation; research and development in the field of photovoltaic energy, design and development of photovoltaic solar systems and modules; design and development of photovoltaic solar power stations;

SMARTCUT

Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, and electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ions, implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatements used in the semiconductor industry;The mark consists of the wording SMART CUT and circular designs. The color blue appears on the circular designs and the word SMART; the color white appears on the mark background; and the color black appears on the word CUT.;SMART CUT;The color(s) blue, white and black is/are claimed as a feature of the mark.;

SMARTSIC

Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces; treatment of substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially thin layer chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition; treatment of materials, namely, manufacturing by sublimation (PVT: Physical Vapor Transport); treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, namely, manufacturing by powder sintering processes;Multi-layer substrates consisting of semiconductors; multi-layer substrates consisting of semiconductors for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes;Testing semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition, in the field of sublimation manufacturing (PVT: Physical Vapor Transport), in the field of powder sintering process manufacturing; engineering and engineering services in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering electric radio frequency currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; engineering and engineering services in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition, in the field of sublimation manufacturing (PVT: Physical Vapor Transport), in the field of powder sintering process manufacturing; technical assistance and support services, namely, technical advice for the development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; technical assistance and support services, namely, technical advice for the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material layer transfer, semiconductors or components on all media, in the field of ion implantation in materials, in the field of layer deposition of materials, especially in epitaxy,in the field of chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition, in the field of sublimation manufacturing (PVT: Physical Vapor Transport), in the field of powder sintering process manufacturing;

SOITEC

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY;The three (3) smaller circles on the periphery and partially hidden by the larger white circle are colored blue.;SILICON WAFERS; SEMICONDUCTORS; SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; COMPONENTS FOR MICROELECTRONIC PURPOSES AND MICRO-MECHANIC PURPOSES; NAMELY, SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; MATERIAL SUBSTRATES FOR MICROELECTRONICS AND MICRO-MECHANICS, NAMELY, ELECTRO-OPTICAL FILM OR SEMICONDUCTORS SUBSTRATES FOR USE IN THE MANUFACTURE OF FLAT PANEL DISPLAYS, INTEGRATED OPTICAL WAVE GUIDES, SENSORS, INTEGRATED CIRCUITS CARDS AND SMART CARDS AND MAGNETIC IDENTITY CARDS; CONDUCTOR SILICON WAFERS FOR MICRO-MACHINING APPLICATIONS;Color is not claimed as a feature of the mark.;NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS, INTEGRATED CIRCUITS, AND SENSORS;SCIENTIFIC, TECHNOLOGICAL, TECHNICAL AND INDUSTRIAL RESEARCH IN THE FIELD OF MICROELECTRONICS; MATERIAL TESTING SERVICES FOR OTHERS; LABORATORY RESEARCH IN THE FIELD OF MICROELECTRONICS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS; ENGINEERING AND SURVEYING IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS;The drawing is lined for the color(s) blue.;

SOITEC

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY;SILICON WAFERS; SEMICONDUCTORS; SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; COMPONENTS FOR MICROELECTRONIC PURPOSES AND MICRO-MECHANIC PURPOSES, NAMELY, SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; MATERIAL SUBSTRATES FOR MICROELECTRONICS AND MICRO-MECHANICS, NAMELY, ELECTRO-OPTICAL FILM OR SEMICONDUCTORS SUBSTRATES FOR USE IN THE MANUFACTURE OF FLAT PANEL DISPLAYS, INTEGRATED OPTICAL WAVE GUIDES, SENSORS, INTEGRATED CIRCUITS CARDS AND SMART CARDS AND MAGNETIC IDENTITY CARDS; CONDUCTOR SILICON WAFERS FOR MICRO-MACHINING APPLICATIONS;Color is not claimed as a feature of the mark.;NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS, INTEGRATED CIRCUITS, AND SENSORS;SCIENTIFIC, TECHNOLOGICAL, TECHNICAL AND INDUSTRIAL RESEARCH IN THE FIELD OF MICROELECTRONICS; MATERIAL TESTING SERVICES FOR OTHERS; LABORATORY RESEARCH IN THE FIELD OF MICROELECTRONICS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS; ENGINEERING AND SURVEYING IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS;

SOITEC

SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS, NAMELY, MODIFICATION OF PHYSICAL, CHEMICAL, ELECTRICAL PROPERTIES OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS BY THERMAL TREATMENT, ION IMPLANTATION, CHEMICAL TREATMENT, SPLITTING AND ALL TREATMENT USED IN THE SEMICONDUCTOR INDUSTRY;SILICON WAFERS; SEMICONDUCTORS; SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; COMPONENTS FOR MICROELECTRONIC PURPOSES AND MICRO-MECHANIC PURPOSES, NAMELY, SILICON WAFERS AND SEMICONDUCTORS FOR PRINTED CIRCUITS AND INTEGRATED CIRCUITS; MATERIAL SUBSTRATES FOR MICROELECTRONICS AND MICRO-MECHANICS, NAMELY, ELECTRO-OPTICAL FILM OR SEMICONDUCTORS SUBSTRATES FOR USE IN THE MANUFACTURE OF FLAT PANEL DISPLAYS, INTEGRATED OPTICAL WAVE GUIDES, SENSORS, INTEGRATED CIRCUITS CARDS AND SMART CARDS AND MAGNETIC IDENTITY CARDS; CONDUCTOR SILICON WAFERS FOR MICRO-MACHINING APPLICATIONS;[ NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS, INTEGRATED CIRCUITS, AND SENSORS ];SCIENTIFIC, TECHNOLOGICAL, TECHNICAL AND INDUSTRIAL RESEARCH IN THE FIELD OF MICROELECTRONICS; MATERIAL TESTING SERVICES FOR OTHERS LABORATORY RESEARCH IN THE FIELD OF MICROELECTRONICS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS; RESEARCH AND DEVELOPMENT OF NEW PRODUCTS FOR OTHERS IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS; ENGINEERING AND SURVEYING IN THE FIELD OF SILICON WAFERS AND IN THE FIELD OF SEMICONDUCTORS FOR INTEGRATED CIRCUITS;

SOITEC

Treatment of materials, namely, mechanical, chemical and physical treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits and machining and gluing of material surfaces; treatment of substrates for microelectronics and optoelectronics, photovoltaics and micromechanics and all derived activities; treating semiconductor wafers and semiconductors; burnishing by abrasion of semiconductor wafers; applying finishes to semiconductors, namely, transfer of layers of materials, semiconductors or components on any media; treating silicon wafers and semiconductor wafers; [ magnetization of semiconductor materials substrates and silicon wafers; ] burnishing by abrasion of silicon wafers and semiconductor wafers; applying finishes to silicon and semiconductors, namely, transfer of layers of silicon, semiconductors or components on all media [ production of solar power ];Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activities; blank [ magnetic, ] optical and digital [ and electronic ] recording media; semiconductor wafers; semiconductors; silicon and semiconductor wafers for printed circuits, [ integrated circuits and derived activities; ] components for microelectronics, micromechanics and optoelectronics, namely, silicon wafers and semiconductors for printed circuits and integrated circuits; semiconductor wafers for light-emitting diodes, radiofrequency (RF) components and power components; substrates for microelectronics, optoelectronics and micromechanics, for flat screens, light-emitting diodes, integrated optical guides, sensors, integrated circuit cards being smart cards, radiofrequency (RF) and power components, namely, electro-optical film or semiconductor substrates for use in the manufacture of flat panel displays, integrated optical wave guides, and sensors [ integrated circuit cards and smart cards and magnetic identity cards; transistors, microelectronic circuits, Microsystems comprising micronetworks for use in the design of integrated circuits; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; lasers, not for medical purposes; diodes, photodiodes, light-emitting diodes, laser diodes, high performance semiconductor laser diodes, photodiode detectors, optical conductors in the nature of waveguide conductors, photocouplers, optical sensors, light-emitting diode units; light gathering apparatus and devices combined with solar cells for producing electricity, namely, photovoltaic cells and solar collector sold as a unit; light gathering apparatus and devices combined with solar cells for producing energy, namely, photovoltaic cells and solar collector sold as a unit; solar cells for producing electricity; solar cell modules for producing electricity; solar energy installations being solar panels for producing electricity; solar cells; solar cells for household use; solar cells for industrial use; photovoltaic cells and modules for producing electricity as well as installations consisting thereof, namely, solar modules for production of electricity, solar thermal and electric receivers, tracking mechanisms and concentrating optics and control algorithms; inverters for photovoltaic applications ];[ Distribution of electricity ];[ Installation and repair of electric power stations ];[ Lighting apparatus, namely, lighting installations; lighting fixtures and electric lamps; lighting equipment in the nature of lamps and lighting systems comprising lamps and lighting sources in the nature of LED light bulbs; lighting equipment and systems made with light-emiting diodes in the nature of LED lighting fixtures for indoor and outdoor lighting applications and systems made with light-emitting diodes comprising LED modules, power supplies and wiring; LED lamps and LED floor lamps and structural parts thereof; lighting systems made with light-emitting diodes comprising LED modules, power supplies and wiring and lighting installations made with light-emitting diodes and structural parts thereof made with light-emiting diodes ];Scientific, technological, technical and industrial research provided by engineers in the field of microelectronics; testing of materials; laboratory work for others, namely, testing of materials and research and development in the field of microelectronics; research and development for others in the field of microelectronics; research and development of new products for others; research and development of new products in the field of wafers and semiconductors for optoelectronic components, radiofrequency (RF) components, power components and derived activities; research and development of new products in the field of silicon wafers and semiconductors for integrated circuits and derived activities; research and development of new products in the field of transferring microelectronic circuits or microsystems on all media and derived activities; engineering services and engineering work in the field of semiconductor wafers and semiconductors for optoelectronic, radiofrequency (RF) and power components and derived activities; engineering and engineering appraisals in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of microelectronic circuits or microsystems on all media and derived activities; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, transistors, diodes, photodiodes, light-emitting diodes and photodiode detectors; technical support and assistance services, namely, technological advice for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, transistors, diodes, photodiodes, light-emitting diodes and photodiode detectors [ developing photovoltaic applications; developing photovoltaic systems and units; developing solar power stations; design and development of lighting apparatus ];

SOITEC

Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation for layer exfoliation, grinding, chemical and physical layer deposition in the nature of electrophoretic coating services, epitaxy, and bonding of material for layer transfer; Treatment of substrates by means of glass substrate polishing, grinding, chemical treatment of surface to remove particles and/or contaminants, laser irradiation, plasma treatment in the nature of applying plasma finishes, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, heat treatment, plasma activation to hydrophilize surfaces, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, photovoltaics, microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of semiconductor wafers, transfer of layer by exfoliation; treatment of silicon wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of silicon wafers and semiconductors, transfer of layer by exfoliation;The mark consists of the stylized word SOITEC appearing in black font with the O formed by three ovals with pointed ends. The ovals are blue, green, and black. The color grey represents background and is not a feature of the mark.;Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, semiconductor chips, integrated circuits, transistors, capacitors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories; semi-conductor wafers; semi-conductors; silicon wafers and semiconductors for integrated circuits and derived activities; semiconductor wafers for light-emitting diodes, radio frequency (RF) components and for power components; substrates for micro-electronics, opto-electronics, micro-engineering, light-emitting diodes, micro-systems, photovoltaics, integrated optical guides, sensors, integrated circuits, radio frequency (RF) and power components, namely, semiconductor chips, integrated circuits, transistors, capacitors, cable connectors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories;The color(s) black, blue, and green is/are claimed as a feature of the mark.;Scientific, technological, technical and industrial research in the field of material science for micro-electronics, opto-electronics, piezo electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development; research and development of new products for others; scientific research and development in the field of wafers and semiconductors for opto-electronic and piezo electronics components, photovoltaics, radio frequency (RF) components, power components, micro-engineering, and micro-systems; scientific research and development in the field of silicon wafers and semiconductors for integrated circuits and derived activities; scientific research and development in the field of the transfer of micro-electronic circuits or micro-systems on all media; engineering and engineering services in the field of semiconductor wafers and semiconductors for micro-electronic, opto-electronic, piezo-electronic radio frequency (RF), micro-mechanical, photovoltaic components, memories, power components; engineering and engineering services in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of micro-electronic or opto-electronic circuits or micro-systems on all types of media; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, memories, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems; assistance and technical support, namely, technical advice in the field of development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems;

SOPSIC

Treatment of base materials for the manufacture of electronic, microelectronic, optical, and optoelectronic devices for third parties;Silicon carbide based substrates for the manufacture of electronic, microelectronic, optical, optoelectronic devices, for the manufacture of transistors, power components, high-frequency components and for derived activities in the field of components for microelectronics;The wording SOPSIC has no meaning in a foreign language.;Technical support services, namely, providing advice for the development of new products, especially in the field of semiconductor wafer materials;