TREATMENT SEMICONDUCTOR MATERIALS

Brand Owner Address Description
SMARTSIC SOITEC Parc Technoloqique des Fontaines, Chemin des Franques F-38190 BERNIN France Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces; treatment of substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially thin layer chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition; treatment of materials, namely, manufacturing by sublimation (PVT: Physical Vapor Transport); treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, namely, manufacturing by powder sintering processes;Multi-layer substrates consisting of semiconductors; multi-layer substrates consisting of semiconductors for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes;Testing semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition, in the field of sublimation manufacturing (PVT: Physical Vapor Transport), in the field of powder sintering process manufacturing; engineering and engineering services in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering electric radio frequency currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; engineering and engineering services in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition, in the field of sublimation manufacturing (PVT: Physical Vapor Transport), in the field of powder sintering process manufacturing; technical assistance and support services, namely, technical advice for the development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; technical assistance and support services, namely, technical advice for the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material layer transfer, semiconductors or components on all media, in the field of ion implantation in materials, in the field of layer deposition of materials, especially in epitaxy,in the field of chemical (CVD: Chemical Vapor Deposition) or physical (PVD: Physical Vapor Deposition) gas deposition, in the field of sublimation manufacturing (PVT: Physical Vapor Transport), in the field of powder sintering process manufacturing;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The recycling of metal materials is performed by efficiently recovering the metal materials from component materials of a process cartridge. To achieve this object, there is provided a method of recycling a process cartridge containing a toner, wherein in a crushing process of a process cartridge containing a recovered toner, a container shape of the process cartridge is subjected to disassembly treatment to an extent of main component parts, the toner is recovered by suction in a step of disassembly treatment, metal materials, such as ferrous materials and aluminum materials, in component materials of the process cartridge are subjected to separation treatment after the step of disassembly treatment, and each of the materials is subjected to melting treatment thereby to change the materials into forms capable of reuse as ferrous materials and aluminum materials.