S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES

D-BSOI

Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ion implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatment used in the semiconductor industry; transfer of microelectronics circuits, namely, integrated circuits, or of micro-systems, namely, pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, magnetic sensors and actuators, onto different types of support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, piezoelectric support materials; mechanical, chemical and physical treatment and machining of surfaces of wafers; stacking of integrated circuits, namely custom fabrication of semi-conductors for others; treatment of wafers for micro-electronics and any derived activities, namely, nano-electronics, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; fabrication of micro-systems as described by technologies coming from microelectronics, namely, prototype fabrication of new products for others in the field of microelectronics; treatment of silicon circuit boards and semiconductors, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; polishing of silicon circuit wafers and semiconductors, namely, modification of roughness of surface by chemical-mechanical-polishing treatment; transfer of silicon layers, semiconductors or components onto other support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, ceramics, piezoelectric support materials;Magnetic components, namely magnetic head, magnetic random access memory; optical devices, namely optical switch, optical multiplexer; silicon circuit boards; semiconductors; silicon circuit boards and semiconductors for printed circuits and integrated circuits; micro-electronics circuits and micro-mechanics components, namely pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA; semiconductor wafers for micro-electronics and micro-mechanics, namely, for flat screens, for integrated optical guides, for sensors, for smart cards or microprocessor cards, for magnetic identification cards; micro-electronic circuits, micro-systems, namely, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, pressure sensors, accelerometers, gyrometers;Communication and services of electronic mail by computer, telephone, satellite network or radio relay system; services of transmission of information, messages, images, sounds, video, software or data notably by computer, telephone, satellite network or radio relay system;Silicon and semiconductor substrates for use in the field of microelectronics and micro-mechanics, namely, substrates composed of silicon, gallium arsenide, silicon carbide, indium phosphide, germanium and silica, for use in the manufacture of integrated circuits;Semiconductor substrates for use in the field of microelectronics and micro-mechanics, namely, substrates composed of ceramic and piezoelectric materials, for use in the manufacture of integrated circuits;Scientific, technological, technical and industrial research; material testing; laboratory research for others in the field of silicon circuit boards and semiconductors for integrated circuits and the transfer of microelectronic circuits or micro-systems onto all types of media; research and development of new products for third parties; research and development of new products particularly in the field of silicon circuit boards and semiconductors for integrated circuits and in the field of nano-electronics or fabrication or micro-systems by technologies coming from microelectronics; research and development of new products particularly in the field of transferring microelectronic circuits onto all types of media; engineering and technical consultation, particularly in the field of silicon circuit boards and semiconductors for integrated circuits and the transfer of microelectronic circuits or micro-systems onto all types of media;

QUASIC

material substrates processing for microelectronics, namely, splitting silicon carbide substrates between layers and cutting and polishing said split substrates;microelectronic components, namely, semiconductor material substrates for use in flat screens, integrated optical wave guides, sensors and micro-machining;

TRACIT TECHNOLOGIES

The mark consists of the stylized wording TRACIT in blue, specifically Pantone red 51, green 51, blue 153, and TECHNOLOGIES in grey, specifically Pantone red 128, green 128 blue 128.;[ Magnetic components, namely, magnetic head, magnetic random access memory; optical devices, namely, optical switches, optical multiplexors; ] silicon circuit boards; semiconductors; silicon circuit boards and semiconductors for printed circuits and integrated circuits; [ micro-electronics circuits ] and micro-mechanics components, namely, pressure sensors, accelerometer, gyro meter, optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA; semiconductor wafers for micro-electronics and micro-mechanics, namely, for flat screens, for integrated optical guides, for sensors, for smart cards or microprocessor cards, for magnetic identification cards; micro-electronic circuits, [ micro-systems, namely, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, pressure sensors, accelerometers, gyro meters; ] assembled semiconductor wafers, particularly by using direct wafer bonding or molecular bonding; electronic circuit or microelectronic circuits or micro-systems, namely, pressure sensors, accelerometer, gyrometer, [ optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, magnetic sensors, namely, laboratory equipment in the nature of sensors for sensing magnetic fields, actuators, namely, microswitches, all transferred onto different types of support materials, such as semiconductor wafers, insulating wafers such as silica, plastic, piezoelectric support, silicon circuit boards with an embedded silica layer, semiconductor circuit boards with buried insulator or oxide layers; ] wafers for fabrication of micro-electronics circuits, or microsystems, namely, pressure sensors, accelerometers, gyrometers, optical sensors, bio-sensors, namely, laboratory equipment in the nature of sensors for sensing DNA, magnetic sensors, namely, laboratory equipment in the nature of sensors for sensing magnetic fields, actuators, namely, micro-switches, piezoelectric sensors;technologies;[ Scientific research services; research and development of new products for third parties; research and development of new products for others particularly in the field of silicon circuit boards and semiconductors for new integrated circuits and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics; research and development of new products for others particularly in the field of transferring microelectronic circuits or micro-systems, namely, pressure sensors, accelerometers, gyrometers, optical sensors, bio-sensors, magnetic sensors, and actuators, onto all types of media and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics; engineering and technical consultation, particularly in the field of silicon circuit boards and semiconductors for integrated circuits and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics, and the transfer of microelectronic circuits or micro-systems onto all types of media and derived activities, namely, nano-electronics or fabrication of microsystems by technologies coming from microelectronics; research and development of new products for others, engineering and technical consultation in the field of semiconductor circuit board assembly, particularly with an insulating layer or intermediary oxide layer, and molecular adhesion ];