SHINKO DENKI KOGYO KABUSHIKI KAISHA

ACLP

Integrated circuit parts, namely, packages for integrated circuit assemblies; circuit boards; circuit boards with integrated circuit;ADVANCED CORELESS PACKAGE;

CONTROLMASK

Computer program for the purpose of determining exposing conditions, pattern data of mask less exposing system in the photolithography process of manufacturing the electronic part;CONTROL MASK;

CORELESS. CORE

Printed circuit boards for semiconductor package; packages for semiconductor integrated circuit;

D L L

Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit;DLL;

DE-RDL

Circuit boards; integrated circuit components, namely, packages for integrated circuits; circuit boards with electronic device embedded; integrated circuit components, namely, packages for integrated circuits with electronic device embedded;

DLL+

Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit;

DLL3

Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit;DLL THREE;

HYPERPAC

packages for use in semiconductor devices and parts therefor, namely, integrated circuit assemblies having a semiconductor element(s) which is connected to a conductive circuit(s) and sealed; integrated circuits, automated bonding tapes, leadframes, glass-to-metal seals, hermetic seal headers and ceramic packages for integrated circuit assemblies and optoelectronic assemblies;HYPER PACK;

HYPERQUAD

packages for use in semiconductor devices and parts therefor, namely integrated circuit assemblies having a semiconductor element(s) which is connected to a conductive circuit(s) and sealed; integrated circuits, automated bonding tapes, leadframes, glass-to-metal seals, hermetic seal headers and ceramic packages for integrated circuit assemblies and optoelectronics assemblies;HYPER - QUAD;

I-THOP

multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-up board;

LEOPARCS

Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout design data for generating mask pattern data;The mark LEOPARCS does not identify any particular living individual.;LEOPARCS;The stippling in the drawing is for shading purposes only.;

M3HP

Heat transfer devices, namely, heat pipes and loop heat pipes for use in electronic components, computers, mobile computers and mobile phones to cool heat producing components;

MAAP

packages for use in semiconductor devices and parts therefor, namely integrated circuit assemblies having a semiconductor element(s) which is connected to a conductive circuit(s) and sealed; integrated circuits, automated bonding tapes, leadframes, glass-to-metal seals, hermetic seal headers and ceramic packages for integrated circuit assemblies and optoelectronics assemblies;

MCEP

Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; Packages for integrated circuit with electronic device embedded;

NUMELMASK

Computer program for the purpose of determining exposing conditions, and determining the pattern data of maskless exposing system in the photolithography process of manufacturing integrated circuits, printed circuit boards (PCBs) and IC packages;NEW MAIL MASK;

P-FOP

Circuit boards with semiconductor device embedded;Color is not claimed as a feature of the mark.;

RELIPAC

Circuit boards; circuit board with electronic device embedded; wafer-level chip-size packages, namely, micro semiconductor devices, in which an IC chip is rewired on a surface of the IC chip and electrodes for external connection are formed on the surface thereof;RELY PACKAGE;

THINQUAD

packages for use in semiconductor devices and parts therefor, namely integrated circuit assemblies having a semiconductor element(s) which is connected to a conductive circuit(s) and sealed; integrated circuits, automated bonding tapes, leadframes, glass-to-metal seals, hermetic seal headers and ceramic packages for integrated circuit assemblies and optoelectronics assemblies;THIN QUAD;

TN-P.P.F.

Lead frames for semiconductor devices;