HYSOL HUAWEI ELECTRONICS CO., LTD.

HYSOL

ELECTRICAL INSULATING MATERIALS-NAMELY, THERMOSETTING RESINS USED AS ELECTRICAL INSULATING MATERIALS; EPOXY COMPOUNDS FOR POTTING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; THERMOSETTING POWDERS APPLIED TO PREHEATED OBJECTS BY DUSTING, BY DRY SPRAY PROCESSES AND BY FLUIDIZED BED PROCESSES; CLAMP-ON CASES AND RESIN FILLED CASES FOR IN-LINE, BRANCHED, AND BUTT SPLICES AND TERMINAL ENDS OF ELECTRICAL WIRES AND CABLES; SPLICE CASE GROMMETS FOR SEALING ELECTRICAL WIRES AND CABLES; AND SPLICE CASE PLUGS FOR SEALING UNUSED OPENINGS;

HYSOL

THERMOSETTING PLASTIC MATERIALS, E.G., IN THE FORM OF POWDERS AND LIQUIDS; EPOXY COMPOUNDS FOR POTTING OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; MULTI-COMPONENT THERMOSETTING RESINS FOR LOW DENSITY TOOLING AND STRUCTURAL APPLICATIONS; AND MOLDABLE SYNTHETIC CLAY-LIKE MATERIAL SETTING TO A SOLID WHICH CAN BE WORKED LIKE WOOD; RESIN BASE ADHESIVE COMPOSITIONS-NAMELY, ADHESIVE SEALANTS AND COATINGS; AND CONDUCTIVE CEMENTS AND ADHESIVE COATINGS;