ELECTRICAL INSULATING MATERIALS NAMELY

Brand Owner (click to sort) Address Description
DAYS KERITE HUBBELL INCORPORATED 40 Waterview Drive Shelton CT 06484 ELECTRICAL INSULATING MATERIALS-NAMELY, FRICTION TAPE AND SPLICING COMPOUND TAPE;
DOLPH'S JOHN C. DOLPH COMPANY 200 Von Roll Drive Schenectady NY 12306 ELECTRICAL INSULATING MATERIALS-NAMELY, VARNISHES, LACQUERS AND RESINS;DOLPHS;PROTECTIVE COATINGS-NAMELY, ENAMELS, VARNISHES, LACQUERS AND NATURAL RESINS;ADHESIVES-NAMELY, THERMOPLASTIC AND THERMOSETTING ADHESIVES AND CEMENTS, AND SYNTHETIC RESINS;
HYSOL HYSOL HUAWEI ELECTRONICS CO., LTD. 8 ZHENHUA ROAD, HIGH-TECH INDUSTRIAL DEVELOPMENT, ZONE LIANYUNGANG, JIANGSU China ELECTRICAL INSULATING MATERIALS-NAMELY, THERMOSETTING RESINS USED AS ELECTRICAL INSULATING MATERIALS; EPOXY COMPOUNDS FOR POTTING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; THERMOSETTING POWDERS APPLIED TO PREHEATED OBJECTS BY DUSTING, BY DRY SPRAY PROCESSES AND BY FLUIDIZED BED PROCESSES; CLAMP-ON CASES AND RESIN FILLED CASES FOR IN-LINE, BRANCHED, AND BUTT SPLICES AND TERMINAL ENDS OF ELECTRICAL WIRES AND CABLES; SPLICE CASE GROMMETS FOR SEALING ELECTRICAL WIRES AND CABLES; AND SPLICE CASE PLUGS FOR SEALING UNUSED OPENINGS;
KERITE HUBBELL INCORPORATED 40 Waterview Drive Shelton CT 06484 ELECTRICAL INSULATING MATERIALS-NAMELY, FRICTION TAPE, SPLICING COMPOUND TAPE, AND INSULATING PUTTY;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.