MULTI LAYER CIRCUIT BOARDS MOUNTING

Brand	Owner	Address	Description
I-THOP	SHINKO DENKI KOGYO KABUSHIKI KAISHA	80, Oshimada-machi, Nagano-shi Nagano 381-2287 Japan	multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-up board;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An electrical assembly (200, FIG. 2) is formed from two, interconnected circuit boards (202, 204). Conductive spacers (240) and a conductive material (260) are placed between complementary bond pads (218, 232) on the circuit boards. The conductive spacers are formed from a material that maintains its mechanical integrity during the process of attaching the circuit boards. The conductive material is a solder or conductive adhesive used to mechanically attach the circuit boards. In addition, an insulating material (270) is inserted into an interface region (250) between the circuit boards. The insulating material provides additional mechanical connection between the circuit boards. In one embodiment, one circuit board (202) includes a glass panel that holds an array of organic light emitting diodes (OLEDs), and the other circuit board (204) is a ceramic circuit board. Together, the interconnected circuit board assembly (200) forms a portion of a flat panel display (1102, FIG. 11).