ASSEMBLY CUSTOM MANUFACTURE

Brand Owner (click to sort) Address Description
FCCUBE STATS CHIPPAC PTE. LTD. 5 YISHUN STREET 23 SINGAPORE 768442 Singapore assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others;FLIP CHIP CUBE;
FCCUBE STATS ChipPAC Ltd. 10 Ang Mo Kio Street 65 #05-17/20 Techpoint Singapore 569059 Singapore assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others;FLIP CHIP CUBE;
N NEW ENGLAND LAB LAB-TESTED FURNITURE SYSTEMS New England Laboratory Casework, Co., Inc. 3 Arrow Drive Woburn MA 01801 Assembly and custom manufacture of metal, wood and laminate laboratory casework;The mark consists of the letter N in a rectangle and the words NEW ENGLAND LAB and LAB-TESTED FURNITURE SYSTEMS.;Installation of metal, wood and laminate laboratory casework;as to NEW ENGLAND LAB and LAB-TESTED FURNITURE SYSTEMS;Color is not claimed as a feature of the mark.;
NEW ENGLAND LAB New England Laboratory Casework, Inc. 3 Arrow Drive Woburn MA 01801 Assembly and custom manufacture of metal, wood, and laminate laboratory casework;Installation of metal, wood and laminate laboratory casework;
NEW ENGLANDLAB LABORATORY FURNITURE SYSTEMS New England Laboratory Casework, Inc. 3 Arrow Drive Woburn MA 01801 Assembly and custom manufacture of metal, wood and laminate laboratory casework;The mark consists of the words NEW ENGLAND LAB LABORATORY FURNITURE SYSTEMS in combination with a unique design element.;Installation of metal, wood and laminate laboratory casework;NEW ENGLAND LAB LABORATORY FURNITURE SYSTEMS;as to New England Lab, Laboratory Furniture Systems;New England Lab, Laboratory Furniture Systems;
STATSCHIPPAC STATS CHIPPAC, INC. 46429 Landing Parkway FREMONT CA 94538 Assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others;In the Statement, Column 2, line 1, packing should be deleted, and, packaging should be inserted.;STATS CHIPPAC;Software engineering services; engineering testing services relating to the assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing facilities and equipment for others to test electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices; back-end turn key services, namely, test development services, wafer sort services, final test services, and [ packing ] *packaging* design services for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing scientific and technical information, advice and consultation relating to product design, product development, product engineering, product testing, and product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An invention is provided for incorporating web services into JSP tag libraries for use in JSP pages. As a result, web page authors can develop JSP pages, which utilize web services from WSDL enabled servers, without an in-depth knowledge of WSDL. In general, a web services based document is received, which defines a set of web service operations. Each web service operation is translated into a custom action, and the custom actions are grouped into a tag library. Generally, the web services based document can be a WSDL document, and the custom actions can be JSP custom actions. Also, the tag library can be a JSP custom tag library. Particular custom actions from the custom actions that are grouped in the JSP custom tag library can be incorporated in a JSP page. Once the JSP page is created, content for the JSP page can be obtained from a web service using the JSP custom tag library. The JSP page can then generate a document based on the content. The document can be an HTML document, an XML document, or any other type document as needed for the particular situation.