STATS CHIPPAC, INC.

CHIPPAC

MANUFACTURING AND ASSEMBLY FOR OTHERS OF PACKAGING FOR INTEGRATED CIRCUITS;CHIP PACK;ENGINEERING, DESIGN AND TESTING SERVICES; NAMELY, DEVELOPMENT, DESIGN, ENGINEERING AND TESTING FOR OTHERS OF PACKAGING FOR INTEGRATED CIRCUITS; DEVELOPMENT, DESIGN AND ENGINEERING FOR OTHERS OF PROCESSES FOR MANUFACTURING, ASSEMBLY AND TESTING OF PACKAGING FOR INTEGRATED CIRCUITS;

IQUAD

MANUFACTURING AND ASSEMBLY FOR OTHERS OF PACKAGING FOR INTEGRATED CIRCUITS;ENGINEERING, DESIGN AND TESTING SERVICES; NAMELY, DEVELOPMENT, DESIGN, ENGINEERING AND TESTING FOR OTHERS OF PACKAGING FOR INTEGRATED CIRCUITS; DEVELOPMENT, DESIGN AND ENGINEERING FOR OTHERS OF PROCESSES FOR MANUFACTURING, ASSEMBLY AND TESTING OF PACKAGING FOR INTEGRATED CIRCUITS;

STATSCHIPPAC

Assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others;In the Statement, Column 2, line 1, packing should be deleted, and, packaging should be inserted.;STATS CHIPPAC;Software engineering services; engineering testing services relating to the assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing facilities and equipment for others to test electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices; back-end turn key services, namely, test development services, wafer sort services, final test services, and [ packing ] *packaging* design services for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing scientific and technical information, advice and consultation relating to product design, product development, product engineering, product testing, and product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices;