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Welcome to the Brand page for “STEAG MICROTECH”, which is offered here for In the statement, column 1, before line 1, steag microtech gmbh (fed. rep. germany limited partnership) carl-benz-strasse 10, pliezhausen, fed, rep. germany 72124, by assignment and change of name from should be inserted.;mechanical apparatus, equipment and systems for manufacturing semiconductor substrates, silicon chips, wafers, lcd-substrates, lcd-displays, semiconductor chips, compact discs, video discs, cd-roms and solar cells; drying and wet processing apparatus for treating semiconductor susbstrates, silicon chips, wafers, lcd-substrates, lcd-displays, semiconductor chips, compact discs, video discs, cd-roms and solar cells as well as the surfaces thereof; manual and automatic apparatus for cleaning, lacquering, developing, etching and stripping semiconductor substrates, lcd-substrates, silicon discs and wafers as well as for developing masks for manufacturing semiconductor chips and for wafer treatment; spin coating apparatus for photo lacquers and color layers; apparatus, equipment, and systems for drying, cleaning and etching silicon discs during semiconductor chip manufacture as well as wet process apparatus and equipment therefor;installation and maintenance for others of the following items - mechanical apparatus, equipment and systems for manufacturing semiconductor substrates, silicon chips, wafers, lcd-substrates, lcd-displays, semiconductor chips, compact discs, video discs, cd-roms and solar cells; drying and wet processing apparatus for treating semiconductor substrates, silicon chips, wafers, lcd-substrates, lcd-displays, semiconductor chips, compact discs, video discs, cd-roms and solar cells as well as the surfaces thereof; manual and automatic apparatus for cleaning, lacquering, developing, etching and stripping semiconductor substrates, lcd-substrates, silicon discs and wafers as well as for developing masks for manufacturing semiconductor chips and for wafer treatment; spin coating apparatus for photo lacquers and color layers; apparatus, equipment, and systems for drying, cleaning and etching silicon discs during semiconductor chip manufacture as well as wet process apparatus and equipment therefor;.
Its status is currently believed to be active. Its class is unavailable. “STEAG MICROTECH” is believed to be currently owned by “STEAG MICROTECH GMBH”.
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STEAG MICROTECH GMBH
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In the statement, Column 1, before line 1, Steag Microtech GMBH (Fed. Rep. Germany Limited Partnership) Carl-Benz-Strasse 10, Pliezhausen, Fed, Rep. Germany 72124, by assignment and change of name from should be inserted.;mechanical apparatus, equipment and systems for manufacturing semiconductor substrates, silicon chips, wafers, LCD-substrates, LCD-displays, semiconductor chips, compact discs, video discs, CD-Roms and solar cells; drying and wet processing apparatus for treating semiconductor susbstrates, silicon chips, wafers, LCD-substrates, LCD-displays, semiconductor chips, compact discs, video discs, CD-Roms and solar cells as well as the surfaces thereof; manual and automatic apparatus for cleaning, lacquering, developing, etching and stripping semiconductor substrates, LCD-substrates, silicon discs and wafers as well as for developing masks for manufacturing semiconductor chips and for wafer treatment; spin coating apparatus for photo lacquers and color layers; apparatus, equipment, and systems for drying, cleaning and etching silicon discs during semiconductor chip manufacture as well as wet process apparatus and equipment therefor;installation and maintenance for others of the following items - mechanical apparatus, equipment and systems for manufacturing semiconductor substrates, silicon chips, wafers, LCD-substrates, LCD-displays, semiconductor chips, compact discs, video discs, CD-ROMs and solar cells; drying and wet processing apparatus for treating semiconductor substrates, silicon chips, wafers, LCD-substrates, LCD-displays, semiconductor chips, compact discs, video discs, CD-ROMs and solar cells as well as the surfaces thereof; manual and automatic apparatus for cleaning, lacquering, developing, etching and stripping semiconductor substrates, LCD-substrates, silicon discs and wafers as well as for developing masks for manufacturing semiconductor chips and for wafer treatment; spin coating apparatus for photo lacquers and color layers; apparatus, equipment, and systems for drying, cleaning and etching silicon discs during semiconductor chip manufacture as well as wet process apparatus and equipment therefor;
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