TOYODA VAN MOPPES LTD.

E-FLANGE

Metalworking machine tools; whetstones for metalworking machines; semiconductor making equipment, namely, machines for manufacturing, treating and grinding semiconductors; semiconductor making equipment, namely, grindstone mounts for securing a grinding wheel to semiconductor manufacturing equipment; whetstones for semiconductor making equipment; stone working machine tools, namely, machine tools for grinding stone; stone working machine tools, namely, grindstone mounts for securing a grinding wheel to stone working machine tools; whetstones for stone working machines; ceramics working machine tools, namely, machine tools for grinding ceramics; ceramics working machine tools, namely, grindstone mounts for securing a grinding wheel to ceramics working machine tools; whetstones for ceramics working machines;E - F L A N G E;

TVMK

The mark consists of the letters TVMK presented in stylized form within a lined triangle design, all contained within a circle.;Parts of metalworking machines, namely, grinding tools, abrasive disks and belts for power-operated metal grinding machines, abrasive wheels for power-operated metal grinding machines, anti-abrasive cemented carbide tools; machine parts, namely, grindstones for metalworking machines and tools, superabrasive grindstones, superabrasive grindstones for grinding machines, grinding stones for grinders, diamond grinding stones, and CBN grinding stones; sharpening wheels for power-operated metalworking machines; grinding machines for metalworking; metalworking machine tools for cutting metal; semiconductor wafer grinding machines; machine tools for the cutting of materials; cemented carbide cutting tools, being parts of machines; diamond-pointed metal-cutting tools, being parts of machines; machines for manufacturing semiconductors; grindstone machine systems for manufacturing semiconductors, comprising machines for manufacturing semiconductors and grindstones therefor; machine parts, namely, grindstones for semiconductor manufacturing machines and machine systems, and grindstones for cutting semiconductor wafers; machines and machine apparatus for cutting semiconductor wafers; parts of machines for cutting semiconductor wafers, namely, blades; die-cutting machines; stone working machines and machine apparatus; machine parts, namely, grindstones for stone working machines and machine apparatus; ceramic processing machines and apparatus, namely, milling machines; machine parts, namely, grindstones for ceramic processing machines and apparatus;Color is not claimed as a feature of the mark.;