MITSUI MINING & SMELTING CO., LTD.

A-SOLID

A SOLID;Industrial chemicals; electrolytes for batteries;

BDBF

Printed circuit board; [ temporary board, being fitted carriers for printed circuit boards, namely, supporting templates for use in assembling base plate in manufacture of printed circuit boards; temporary board being fitted carriers for semiconductor packaging modules, namely, supporting templates for use in assembling base plate in manufacture of semiconductor packaging modules; ] printed circuits; integrated circuits; wafers for integrated circuits; circuit boards with integrated circuits; integrated circuit chips; semiconductor apparatus, namely, semiconductor devices;In the statement, class 9 has been corrected per the Restriction dated 04/04/19, and per the Fnote dated 04/29/19.;Plastic semi-worked products, namely, semi-processed plastics; plastic semi-worked products, made of polypropylene, namely, semi-processed polypropylene; adhesive-coated plastic film and sheet for use in further manufacture; laminated composite board made primarily of plastic for use in manufacturing; laminated composite board laminated with plastic film or plastic sheet via adhesives for use in manufacturing; plastic semi-worked products being semi-processed plastics for use in manufacture of printing circuit boards; plastic substances, semi-processed; plastic board for use in manufacturing; plastic film, other than for wrapping, namely, plastic film for supporting purposes in the manufacture of printed circuit boards; plastic film, other than for wrapping, namely, plastic film for supporting purposes in the manufacture of semiconductor packaging modules;Plastic adhesives for industrial purposes; adhesives for use in manufacture of printed circuit boards; adhesives for the temporary attachment of components in the manufacture of circuit boards; glue for industrial purposes; industrial chemicals; gelatin glue for industrial purposes;

DENMAN

MANGANESE DIOXIDE FOR INDUSTRIAL USE;

F

The mark consists of a stylized F with the top and bottom parts in orange and the middle part in yellow.;Both side pure copper laminated boards for use in the manufacture of printed wiring boards intended for use with a built-in condenser; Both side pure copper laminated boards that also contain a built-in condenser for use in the manufacture of printed wiring boards; pure copper foil laminates for use in the manufacture of capacitive printed circuit boards; pure copper foils for use in the manufacture of capacitive printed circuit boards;F;The colors orange and yellow are claimed as a feature of the mark.;