MENLO MICROSYSTEMS, INC.

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The mark consists of an image of a prong with internal shading of a letter i.;Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit;Color is not claimed as a feature of the mark.;Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM);