HD MICROSYSTEMS, LTD.

 HD MICROSYSTEMS, LTD. contact information is shown below
Owner:HD MICROSYSTEMS, LTD.
Owner Address:4-25, KORAKU 1-CHOME, BUNKYO-KU TOKYO 112-0004 Japan
Owner Web Site
Owner Phone
Owner Toll Free
Owner Fax

 

Brands Owned byHD MICROSYSTEMS, LTD.

Brand:

HD MICROSYSTEMS

Description:

Electrical insulating materials; insulating resin; Electrical insulating paints; Insulating coatings for electronic circuit modules; electrical insulators for use in forming polyimide thin film;Industrial chemicals; polyimide coating agents for semiconductor assembly and manufacturing; polyimide coating agents for semiconductor packaging and semiconductor substrate assembly and manufacturing; polyimide coating agents for temporary and permanent bonding adhesive; polyimide coating agents for display screen assembly and manufacturing; polyimide coating agents for electric device assembly and manufacturing including resistors, inductors, transformers, capacitors and MEMS devices; polyimide coating agents for photo, lighting, optical device assembly and manufacturing; polyimide coating agents for sensor device assembly and manufacturing; polyimide coating agents for electronic device assembly and manufacturing; unprocessed polyimide resin; unprocessed artificial resins as raw materials in the form of liquids; Plastics, unprocessed in all forms; Chemical compositions for developing, printing and enlarging photographs; Adhesives for industrial purposes; Unprocessed synthetic resins for the manufacture of paints;MICROSYSTEMS;

Category: ELECTRICAL INSULATING MATERIALS
Brand:

HD MICROSYSTEMS

Description:

The mark consists of a stylized H and a stylized D overlapping each other at an angle, positioned to the left of the words HD MICROSYSTEMS.;Electrical insulating materials; insulating resin; Electrical insulating paints; Insulating coatings for electronic circuit modules; electrical insulators for use in forming polyimide thin film;Color is not claimed as a feature of the mark.;Industrial chemicals; polyimide coating agents for semiconductor assembly and manufacturing; polyimide coating agents for semiconductor packaging and semiconductor substrate assembly and manufacturing; polyimide coating agents for temporary and permanent bonding adhesive; polyimide coating agents for display screen assembly and manufacturing; polyimide coating agents for electric device assembly and manufacturing including resistors, inductors, transformers, capacitors and MEMS devices; polyimide coating agents for Photo, lighting, optical device assembly and manufacturing; polyimide coating agents for sensor device assembly and manufacturing; polyimide coating agents for electronic device assembly and manufacturing; unprocessed polyimide resin; unprocessed artificial resins as raw materials in the form of liquids; Plastics, unprocessed in all forms; Chemical compositions for developing, printing and enlarging photographs; Adhesives for industrial purposes; Unprocessed synthetic resins for the manufacture of paints;MICROSYSTEMS;

Category: