HIGH DENSITY VIA PATTERN (HDVP)

Welcome to the Brand page for “HIGH DENSITY VIA PATTERN (HDVP)”, which is offered here for Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others;printed circuit boards; electronic back panel assemblies, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, cases for panel mounted, electronic instruments in the nature of logic analyzers;high density via pattern (high density via pattern);.

Its status is currently believed to be active. Its class is unavailable. “HIGH DENSITY VIA PATTERN (HDVP)” is believed to be currently owned by “TTM Technologies, Inc.”