WAX CLEANING POLISHING

Brand Owner (click to sort) Address Description
LIQUID LUSTRE Nathans Original Liquid Lustre, Inc. P.O. Box 38 Barker TX 77413 wax for cleaning and polishing automobiles and the like;LIQUID;
LIQUID LUSTRE Nathans Original Liquid Lustre, Inc. P.O. Box 38 Barker TX 77413 wax for cleaning and polishing automobiles and the like;LIQUID;
NATHANS LIQUID LUSTRE Nathans Original Liquid Lustre, Inc. P.O. Box 38 Barker TX 77413 wax for cleaning and polishing automobiles and the like;LIQUID;
THINK PINK Nathans Original Liquid Lustre, Inc. P.O. Box 38 Barker TX 77413 wax for cleaning and polishing automobiles and other motor vehicles; liquid for cleaning and polishing vinyl located in the interior or on the exterior of automobiles and other motor vehicles; liquid for cleaning and polishing copper, brass, silver, gold, aluminum, stainless steel and chrome located on the exterior of automobiles and other motor vehicles; liquid for cleaning the interior of automobiles and other motor vehicles; liquid for cleaning the exterior of automobiles and other motor vehicles; liquid cleaner and deodorizer for the interior of automobiles and other motor vehicles;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.