UNPROCESSED EPOXY RESIN

Brand Owner (click to sort) Address Description
CLARITI Barnes Products Pty Ltd C/O LegalForce RAPC Worldwide 446 E Southern Ave Tempe AZ 85282 Unprocessed epoxy resin; Epoxy resins, unprocessed;
CLEAR POUR NEW KITCHEN OPERATING COMPANY 300 S Madison Ave, Suite 4 Clearwater FL 33756 unprocessed epoxy resin; resin for use in making arts and crafts;
CRAFT CULTURE Capital Acquisitions 4 1013 Centre Rd, Suite 403S Wilmington DE 19805 Unprocessed epoxy resin;CRAFT;
DEWALT THE BLACK & DECKER CORPORATION MR-045 701 E. Joppa Road Towson MD 21286 Unprocessed epoxy resin; construction industry adhesives; industrial adhesives for masonry and concrete use;
EPOX-IT POLYTEK DEVELOPMENT CORP 55 HILTON STREET EASTON PA 18042 Unprocessed epoxy resin;
EXTREME RESIN Silvia, Kyle 34030 Summit View Place Temecula CA 92592 Unprocessed epoxy resin;RESIN;
HOBBY-CAST SMITH, RUSSELL 110 s. norton Los Angeles CA 90004 Unprocessed epoxy resin;
LIQUID DIAMONDS Lucero, Rich Unit F 360 South East End Street Pomona CA 91766 Unprocessed epoxy resin, not for automotive use;
MAKERS PRIME STAR GROUP SOLUTIONS INC. 1501 S Dale Mabry Hwy, Ste A6 Tampa FL 33629 Unprocessed epoxy resin;PRIME;
MR. RESIN White Knight Trading Limited 6804 Greengrove Dr. Las Vegas NV 89103 Unprocessed epoxy resin; Epoxy glue for general bonding and repair purposes; Glue and UV adhesives for industrial and commercial use;
MR. RESIN White Knight Trading 6804 Greengrove Dr. Las Vegas NV 89103 Unprocessed epoxy resin; Epoxy glue for general bonding and repair purposes; Glue and UV adhesives for industrial and commercial use;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 ?m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.