THREE DIMENTIONAL

Brand	Owner	Address	Description
THREEDIMENTIONAL	Yarda y Compania, S.A. de C.V.	Av. Tulum No. 192, Local 51 Plaza Tropical Cancun, Quintana Roo 77500 Mexico	THREE DIMENTIONAL; 3 DIMENSIONAL;specialty beverage containers of plastic; furniture, mirrors, and picture frames;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Wafer scale fabrication of three dimentional substantially enclosed structures on a MEMS/IC die use a combination of electrodeposition of structural and sacrificial layers and flip-chip alignment and bonding technology. A first wafer contains a die with MEMS and/or IC structures. On this MEMS/IC processed die, a first three dimensional structural component is formed using standard lithographic processes and electrodeposition of a structural layer. A second sacrificial wafer is separately processed using similar lithographic and electrodeposition processes to form a corresponding second three dimensional structural component. The wafers are placed in a flip-chip bonder and aligned. Once aligned, the structural components are bonded together. The bonded wafers are then removed from the bonder and the second sacrificial wafer substrate removed. The resultant die includes a three dimensional structural component with a substantially enclosed cavity as well as MEMS and IC elements.