THICK FILM PHOTOPRINTABLE COMPOSITIONS FOR

Brand	Owner	Address	Description
FODEL	DUPONT ELECTRONICS, INC.	974 CENTRE ROAD WILMINGTON DE 19805	THICK FILM PHOTOPRINTABLE COMPOSITIONS FOR USE IN THE MANUFACTURE OF HYBRID MICROCIRCUITS, SEMICONDUCTOR PACKAGES, AND OTHER ELECTRONIC COMPONENTS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 ?m to 100 ?m. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.