THERMALLY CONDUCTIVE POLYMERIC BASED ADHESIVES

Brand	Owner	Address	Description
TEMPRION	DUPONT ELECTRONICS, INC.	974 CENTRE ROAD WILMINGTON DE 19805	THERMALLY CONDUCTIVE POLYMERIC-BASED ADHESIVES AND GAP FILLERS USED FOR HEAT TRANSFER APPLICATIONS IN ELECTRONIC COMPONENTS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally conductive strip such that a portion of the thermally conductive strip extends through the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanical means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.