TESTING APPARATUS TESTING SEMICONDUCTORS

Brand Owner Address Description
INSTRIP Multitest elektronische Systeme GmbH Aeussere Oberaustrasse 4 83026 Rosenheim Germany Testing apparatus for testing semiconductors, semiconductor manufacturing machines, namely, apparatus for the automatic and mechanical handling of electronic, mechanical/electronic and mechanical circuit boards and semiconductors in the area of intermediate and final testing in semiconductor and electronics manufacturing, and structural parts therefor, namely, systems for feeding, transporting, sorting, positioning and seating the circuit boards and semiconductors for the purpose of investigating, measuring and inspecting them; apparatus and instruments for tempering circuit boards and semiconductors, namely, temperature sensors and temperature indicators; data processors and semiconductor devices; devices for the mechanical and optical measurement of circuit boards and semiconductors, namely, instruments for measuring length, instruments for measuring resistance; testing and measuring instruments and supplementary modules for the excitement/stimulation of circuit boards and semiconductors during the test, namely, metal strength testing machine, apparatus for testing gas, liquids and solids;[ Installation, maintenance, and repair of circuit boards and semiconductors ];IN STRIP;[ development of circuit boards and semiconductors; consultation for third parties in the field of circuit board and semiconductor development ];
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Auto-recovery wafer testing apparatus and wafer testing method are provided. The wafer testing apparatus includes a main system, a tester and a real-time accessing module. The main system controls the process of the wafer testing. The tester is electrically coupled to the main system for receiving commands from the main system to perform testing on a plurality of chips sequentially and output the testing data correspondingly. The real-time accessing module is electrically coupled to the tester for simultaneously accessing the testing data. In an event when the testing is accidentally interrupted, the tester can produce auto-recovery data according to the testing data saved in the real-time accessing module, and continue testing, based on the auto-recovery data, from the chip being last but incompletely tested. The use of the wafer testing apparatus and method can save testing time and enhance the production efficiency.