TEST EXAMINATION

Brand Owner Address Description
TESTEX Testex AG Gotthardstrasse 61 CH-8002 Zürich Switzerland TEST EXAMINATION;Scientific research, technological research in the field of textiles, industrial analysis and research in the field of textiles; consulting in the field of textile physics, textile chemistry, and material testing; scientific research services in the nature of monitoring, testing and analyzing the impact of textiles and textile production on pollution, the environment and the health effect on employees engaged in the production of said textiles; consulting services concerning monitoring, testing and analyzing the impact of textiles and textile production on pollution, the environment and the health effect on employees engaged in the production of said textiles; scientific and industrial research relating to textiles, namely, textile-physical and textile-chemical examinations of fibers, yarns, threads, fabrics, mesh cloths, fleeces and other textiles; materials testing, namely, fiber testing, yarn testing, textile defect and damage testing; testing textile response to environmental influences, testing textile color fastness, color measurement, degree of whiteness, UV transmission, flammability; scientific and industrial research relating to textiles, namely, performing trace analysis, residue analysis, washing powders and washing programs and dyestuff analysis; testing services, namely, conducting tests of the textile goods and services of others for the purpose of certification that personal protective equipment used in textile related services and textile products meet industry standards; analysis and evaluation of textile goods of others for the purpose of certification; development of scientific testing methods relating to the aforementioned fields; rental of textile and fiber testing apparatus; design and development of computer hardware and software;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for manufacturing a semiconductor device includes, (a) mounting a plurality of first semiconductor chips in a manner not to overlap with one another on a substrate having a plurality of wiring patterns formed thereon, and electrically connecting each of the first semiconductor chips to any one of the wiring patterns, (b) conducting an electrical examination on a plurality of mounted bodies each including one of the first semiconductor chips and any one of the wiring patterns electrically connected to each other, (c) stacking a second semiconductor chip on the first semiconductor chip of any one of the mounted bodies that pass the electrical examination, excluding any of the mounted bodies that fail the electrical examination and thereafter, (d) cutting the substrate so as to divide the wiring patterns. The electrical examination in step (b) includes a test on each of the wiring patterns, a test on each of the first semiconductor chips, and a test on an electrical connection state between each of the first semiconductor chips and a corresponding one of the wiring patterns, and wherein the electrical examination is a success when passing all of the tests, and the electrical examination is a failure when failing at least one of the tests.