SURFACE POLISHERS SEMICONDUCTOR WAFERS

Brand Owner Address Description
CMP DRY-IN DRY-OUT EBARA CORPORATION 11-1, Haneda Asahi-cho, Ota-ku Tokyo 144-8510 Japan surface polishers for semiconductor wafers;CMP DRY IN DRY OUT;DRY-IN DRY-OUT CMP;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Structures for aligning wafers and methods for operating the same. The structure includes (a) a first semiconductor wafer including a first capacitive coupling structure, and (b) a second semiconductor wafer including a second capacitive coupling structure. The first and second semiconductor wafers are in direct physical contact with each other via a common surface. If the first and second semiconductor wafers are moved with respect to each other by a first displacement distance of 1 nm in a first direction while the first and second semiconductor wafers are in direct physical contact with each other via the common surface, then a change of at least 10