SUBSTRATES USE ELECTRONIC

Brand	Owner (click to sort)	Address	Description
VIA/PLANE	CIRCUIT COMPONENTS INC.	2400 South Roosevelt Street Tempe AZ 85282	substrates for use in electronic circuit applications;
VIA/PLANE	MICRO SUBSTRATES CORPORATION	2400 South Roosevelt Street Tempe AZ 85282	substrates for use in electronic circuit applications;
VIAGRID	SHELDAHL, INC.	1150 Sheldahl Road Northfield MN 550570170	substrates for use in electronic circuit applications;
VIARESIST	SHELDAHL, INC.	1150 Sheldahl Road Northfield MN 550570170	substrates for use in electronic circuit applications;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

The invention relates to a method for producing a transponder, especially a contactless chip card (1) comprising at least one electronic component (chip module 2) and at least one antenna (3); the at least one electronic chip component (2) being disposed on a non-conducting substrate that serves as a support for the component. The at least one antenna is also disposed on a non-conducting substrate, the at least one electronic component (2) being applied to a first substrate and the antenna (3) on a second substrate. The entire circuit (1) is then produced by joining the individual substrates so that they are correctly positioned relative to each other. The components (2, 3) are contacted once the different substrates have been joint by means of auxiliary materials such as solder or glue, or without auxiliary materials by microwelding. The non-conducting substrates form a base card body.