SUBSTRATES SEMI CONDUCTORS

Brand Owner (click to sort) Address Description
ABTS NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan Substrates for semi-conductors, namely, supporting board on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached or in which electronic devices including integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards which are attached in thermal printer heads; polyimide thin film multilayer substrates for semiconductors, namely, supporting material on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached; integrated circuits and circuit boards for semiconductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator, SAW (Surface Acoustic Wave) and filter; leadless chip carriers, interposers for semi-conductors, namely, connectors for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resistors and chip inductors are installed; packages for high frequency band, namely, protective housings for electronic devices working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring boards for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards;
BULC NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan Substrates for semi-conductors, namely, supporting board on which integrated circuits, chip condensers and chip capacitors are attached or in which integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards that are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which integrated circuits, chip condensers and chip capacitors are attached-- integrated circuits and circuits boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator; SAW(Surface Acoustic Wave) and filter; leadless chip carriers; interposers for semi-conductors, namely, connecters for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards;BULK;
LVST NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan SUBSTRATES FOR SEMI-CONDUCTORS; GLAZED SUBSTRATES FOR THERMAL PRINTER HEADS; POLYIMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMI-CONDUCTORS; INTEGRATED CIRCUIT PACKAGES FOR SEMI-CONDUCTORS; CHIP PACKAGES; CRYSTAL RESONATOR SAW (SURFACE ACOUSTIC WAVE) FILTER PACKAGE; LEADLESS CHIP CARRIERS; INTERPOSERS FOR SEMI-CONDUCTORS; PRINTED CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS; PIN GRID ARRAY CHIP PACKAGES; BALL GRID ARRAY CHIP PACKAGES; ALUMINUM NITRIDE PRODUCTS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; CERDIPS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; PRINTED CIRCUITS, PRINTED WIRING; MULTILAYER PRINTED CIRCUIT BOARDS;
LVTS NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan SUBSTRATES FOR SEMI-CONDUCTORS; GLAZED SUBSTRATES FOR THERMAL PRINTER HEADS; POLYIMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMI-CONDUCTORS; INTEGRATED CIRCUIT PACKAGES FOR SEMI-CONDUCTORS; CHIP PACKAGES; CRYSTAL RESONATOR SAW (SURFACE ACOUSTIC WAVE) FILTER PACKAGE; LEADLESS CHIP CARRIERS; INTERPOSERS FOR SEMI-CONDUCTORS; PRINTED CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS; PIN GRID ARRAY CHIP PACKAGES; BALL GRID ARRAY CHIP PACKAGES; ALUMINUM NITRIDE PRODUCTS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; CERDIPS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; PRINTED CIRCUITS, PRINTED WIRING; MULTILAYER PRINTED CIRCUIT BOARDS;
NFTS NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan SUBSTRATES FOR SEMI-CONDUCTORS; GLAZED SUBSTRATES FOR THERMAL PRINTER HEADS; POLYIMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMI-CONDUCTORS; INTEGRATED CIRCUIT PACKAGES FOR SEMI-CONDUCTORS; CHIP PACKAGES; CRYSTAL RESONATOR SAW (SURFACE ACOUSTIC WAVE) FILTER PACKAGE; LEADLESS CHIP CARRIERS; INTERPOSERS FOR SEMI-CONDUCTORS; PRINTED CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS; PIN GRID ARRAY CHIP PACKAGES; BALL GRID ARRAY CHIP PACKAGES; ALUMINUM NITRIDE PRODUCTS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; CERDIPS, NAMELY, CERAMIC PACKAGES OR SUBSTRATES USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS; PRINTED CIRCUITS, PRINTED WIRING; MULTILAYER PRINTED CIRCUIT BOARDS;INSULATORS FOR SEMI-CONDUCTORS;
NTS NGK SPARK PLUG CO., LTD 14-18, Takatsuji-cho, Mizuho-ku Nagoya City Japan Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW (Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages; ball grid array chip packages; aluminum nitride products, namely, ceramic packages or substrates used in the manufacture of integrated circuits; cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit boards;Insulators for semi-conductors;
SOLDER BALL INTERPOSER NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board;
SSBU NGK SPARK PLUG CO., LTD. 1-1-1, Higashisakura, Higashi-ku, Nagoya-shi 461-0005 Japan Substrates for semi-conductors, namely, supporting board on which electronic devices in the nature of integrated circuits, chip condensers and chip capacitors are attached or in which electronic devices in the nature of integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards which are attached in thermal printer heads; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which electronic devices in the nature of integrated circuits, chip condensers and chip capacitors are attached; integrated circuits and circuit boards for semi-conductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator, SAW (Surface Acoustic Wave) and filter; leadless chip carriers, namely, semi-conductor chip housings; interposers for semi-conductors, namely, connectors for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards for semi-conductors; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resisters and chip inductors are installed; packages for high frequency band, namely, protective housings for electronic devices working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting panels used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method is described for producing tubular substrates having parallel spaced concentric rings of electrical conductors that can be used as the drift tube of an Ion Mobility Spectrometer (IMS). The invention comprises providing electrodes on the inside of a tube that are electrically connected to the outside of the tube through conductors that extend between adjacent plies of substrate that are combined to form the tube. Tubular substrates are formed from flexible polymeric printed wiring board materials, ceramic materials and material compositions of glass and ceramic, commonly known as Low Temperature Co-Fired Ceramic (LTCC). The adjacent plies are sealed together around the electrode.