STANDALONE PERIPHERAL COMPONENT INTERCONNECT

Brand Owner Address Description
MATROX NETWORKS MATROX ELECTRONIC SYSTEMS LTD. 1055 St-Regis Blvd. Dorval, Quebec H9P2T4 Canada standalone and peripheral component interconnect based Ethernet/fast Ethernet products and network management software, namely, peripheral component interconnect based switch; peripheral component interconnect based multiport network interface card; a peripheral component interconnect based fast Ethernet hub card with six ports; peripheral component interconnect based fast Ethernet hub card with six ports 100BaseTX, one dedicated 100BaseTX link to the central processing unit and on board simple network management protocol management; connector box; 12-port fast Ethernet hub; management console for use with peripheral component interconnect based switch; 8 to 16-port ethernet switch hub;NETWORKS;The lining is a feature of the mark and does not indicate color.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on that surface. A second semiconductor component substrate, such as a carrier substrate with interconnect elements such as terminal pads, is adhered to the first semiconductor component substrate, forming a semiconductor package assembly having interconnect voids between the corresponding interconnect elements. A flowable conductive material is then injected into each interconnect void using an injection needle that passes through one of the substrates into the interconnect void, forming a conductive interconnect between the bond pads and terminal pads of the substrates. In another embodiment, a conductive material is preplaced into the interconnect voids and ultrasonically heated to a flowable state.