SOLDERLESS BREADBOARDS

Brand	Owner	Address	Description
BB830	BUSBOARD PROTOTYPE SYSTEMS LTD.	140 - 612 500 Country Hills Blvd NE Calgary, AB T3K5K3 Canada	solderless breadboards, namely, a construction base for prototyping of electronics;BUS BOARD EIGHT HUNDRED THIRTY;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive particles, and a thin, flexible apertured support that aligns the particles with corresponding lands on the IC package and substrate. A compression connector may also be used to electrically couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.