SILICON PLATFORM CHIP INTEGRATING MULTIPLE

Brand	Owner	Address	Description
WIPP	HMicro, Inc.	39355 California Street, Suite 303 Fremont CA 94538	silicon platform chip integrating multiple radio types, sensor interfaces, application processor and power management circuits for building wearable wireless sensors for electrocardiograph monitoring; silicon platform chip integrating multiple radio types, sensor interfaces, application processor and power management circuits for building wearable wireless sensors for physiological vital sign monitoring; silicon platform chip integrating multiple radio types, sensor interfaces, application processor and power management circuits for building wireless sensors for industrial monitoring; silicon platform chip integrating multiple radio types, sensor interfaces, application processor and power management circuits for building wearable wireless sensors for internet of things applications;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.