SEMICONDUCTOR CHIPS SEMICONDUCTOR DEVICES

Brand	Owner (click to sort)	Address	Description
ECOBIT	eMemory Technology Inc.	ROOM 305, NO. 47, PARK AVENUE II RD. SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076 R.O.C. Taiwan	Semiconductor chips and semiconductor devices, all for use in computing devices, communication products, wireless communication products and electronic consumer products; integrated circuits for use in computers, communication products and electronic consumer products; computer hardware, namely, digital memory cards using semiconductor memory to store digital information for use in computers, communication devices and electronic consumer products; memory controllers, namely, integrated circuits used in memory cards for controlling write in/read out data from the memory cards that are applied to computers, telecommunication products and electronic consumer products;ECO BIT;Design and testing of integrated circuits for others; testing and analysis of integrated circuits of others for the purpose of certification; design and testing of semiconductor chips and integrated circuits for others; semiconductor integrated circuit design and consultation in the field of design of semiconductor integrated circuits; integrated circuit design consultation; technical consultation in the field of integrated circuit design;
EMTC	eMemory Technology Inc.	ROOM 305, NO. 47, PARK AVENUE II RD. SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076 R.O.C. Taiwan	Semiconductor chips and semiconductor devices, all for use in computing devices, communication products, wireless communication products and electronic consumer products; integrated circuits for use in computers, communication products and electronic consumer products; computer hardware, namely, digital memory cards using semiconductor memory to store digital information for use in computers, communication devices and electronic consumer products; memory controllers, namely, integrated circuits used in memory cards for controlling write in/read out data from the memory cards that are applied to computers, telecommunication products and electronic consumer products;Design and testing of integrated circuits for others; testing and analysis of integrated circuits for the purpose of certification; design and testing of semiconductor chips and integrated circuits for others; semiconductor integrated circuit design and consultation; integrated circuit design consultation; technical consultation in the fields of integrated circuit design, and data transformation and fabricating procedures with respect to integrated circuits;
ENABLING HOME NETWORKING FOR DIGITAL ENTERTAINMENT	Entropic Communications, Inc.	Suite 200 9276 Scranton Road San Diego CA 92121	Semiconductor chips and semiconductor devices for use in telecommunications products, and software for operating the semiconductor chips and semiconductor devices;
NEOEE	eMemory Technology Inc.	ROOM 305, NO. 47, PARK AVENUE II RD. SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076 R.O.C. Taiwan	Semiconductor chips and semiconductor devices, all for use in computing devices, communication products, wireless communication products and electronic consumer products; integrated circuits for use in computers, communication products and electronic consumer products; computer hardware, namely, digital memory cards using semiconductor memory to store digital information for use in computers, communication devices and electronic consumer products; memory controllers, namely, integrated circuits used in memory cards for controlling write in/read out data from the memory cards that are applied to computers, telecommunication products and electronic consumer products;Design and testing of integrated circuits for others; testing and analysis of integrated circuits of others for the purpose of certification; design and testing of semiconductor chips and integrated circuits for others; semiconductor integrated circuit design and consultation; integrated circuit design consultation; technical consultation in the fields of integrated circuit design, and data transformation and fabricating procedures with respect to integrated circuits;
NEOFLASH	eMemory Technology Inc.	ROOM 305, NO. 47, PARK AVENUE II RD. SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076 R.O.C. Taiwan	Semiconductor chips and semiconductor devices, all for use in computing devices, communication products, wireless communication products and electronic consumer products; integrated circuits for use in computers, communication products and electronic consumer products; computer hardware; namely, digital memory cards using semiconductor memory to store digital information for use in computers, communication devices and electronic consumer products; Memory controllers, namely integrated circuits used in memory cards for controlling write in/read out data from the memory cards that are applied to computers, telecommunication products and electronic consumer products;NEO FLASH;Design and testing of integrated circuits for others; testing and analysis of integrated circuits for the purpose of certification; design and testing of semiconductor chips and integrated circuits for others; semiconductor integrated circuit design and consultation; integrated circuit design consultation; technical consultation in the fields of integrated circuit design, and data transformation and fabricating procedures with respect to integrated circuits;
NEOMTP	eMemory Technology Inc.	ROOM 305, NO. 47, PARK AVENUE II RD. SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076 R.O.C. Taiwan	Semiconductor chips and semiconductor devices, all for use in computing devices, communication products, wireless communication products and electronic consumer products; integrated circuits for use in computers, communication products and electronic consumer products; computer hardware, namely, digital memory cards using semiconductor memory to store digital information for use in computers, communication devices and electronic consumer products; memory controllers, namely, integrated circuits used in memory cards for controlling write in/read out data from the memory cards that are applied to computers, telecommunication products and electronic consumer products;
NEOPUF	eMemory Technology Inc.	ROOM 305, NO. 47, PARK AVENUE II RD. SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076 R.O.C. Taiwan	Semiconductor chips and semiconductor devices, all for use in computing devices, communication products, wireless communication products and electronic consumer products; integrated circuits for use in computers, communication products and electronic consumer products; computer hardware, namely, digital memory cards using semiconductor memory to store digital information for use in computers, communication devices and electronic consumer products; memory controllers, namely, integrated circuits used in memory cards for controlling write in/read out data from the memory cards that are applied to computers, telecommunication products and electronic consumer products;Design and testing of integrated circuits for others; testing and analysis of integrated circuits of others for the purpose of certification; design and testing of semiconductor chips and integrated circuits for others; semiconductor integrated circuit design and consultation in the field of design of semiconductor integrated circuits; integrated circuit design consultation; technical consultation in the field of integrated circuit design;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the closest solder balls of adjacent semiconductor chips becomes "n" times ("n" is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces.