SEMICONDUCTOR CHIPS INCLUDING FIELD PROGRAMMABLE

Brand	Owner	Address	Description
3D ASIC	TIER LOGIC, INC.	2975 Scott Blvd, Suite 215 Santa Clara CA 95054	Semiconductor chips including field programmable gate arrays or FPGAs;HREE D ASIC;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.