SEMICONDUCTOR CHIP CHIP CARRIER

Brand Owner (click to sort) Address Description
BGA TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 semiconductor chip and chip carrier;IN THE STATEMENT, COLUMN 2, LINE 3, 5-19-1995 SHOULD BE DELETED, AND 5-22-1995 SHOULD BE INSERTED.;
COMPLIANT CHIP TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 semiconductor chip and chip carrier;CHIP;
F-UBGA TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 SEMICONDUCTOR CHIP AND CHIP CARRIER;FUBGA;
MICRO BGA TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 semiconductor chip and chip carrier;BGA;
TCC TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 semiconductor chip and chip carrier;
UBGA TESSERA, INC. 3025 Orchard Parkway San Jose CA 95134 SEMICONDUCTOR CHIP AND CHIP CARRIER;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples one or both of the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities. The first chip, e.g., an ASIC chip, is solder bonded to the carrier while the second chip, e.g., a memory chip, is secured to the first chip's upper surface and coupled to the carrier using a plurality of wirebond connections.