SEMICONDUCTOR DEVICES USE

Brand Owner (click to sort) Address Description
IMAGE ENHANCEMENT ENGINE DVDO, Incorporated 1129 Dell Avenue Campbell CA 95008 Semiconductor devices for use in video format conversion;ENGINE;
PROXIF Interflex Datensysteme GmbH Zettachring 16 70567 Stuttgart Germany Semiconductor devices for use in data acquisition; semiconductors for use in data processing for communications applications; computer software for time management used to track project duration, time spent, and project completion schedules; computer software for use for providing access control to data and network access control and support; biometric identification authenticating systems that utilize fingerprint and/or facial recognition hardware and software for use with computer network access control; computer software for the encryption, access control, monitoring and protection of the contents of electronic documents for general use; production control systems comprised of sensors, computer, and software to operate production control systems; computer hardware and software for use in production control and process management system; computer software for parking lot management, including revenue control, access control and count-monitoring; computer software for routing, scheduling, dispatching, and managing job assignment, task status, and location of employees and vehicles; computer software for use in managing job and customer related data, usage, availability, quantity, and type of tools and inventory; computer software for controlling work orders; computer software for sending and receiving work orders via wireless communications networks and computer interface software for system integration;[ Installation and maintenance of data acquisition and data processing equipment ];[ Design for others in the field of data acquisition and data processing equipment ];
SKYFET Siliconix Incorporated 2585 Junction Avenue San Jose CA 95134 SEMICONDUCTOR DEVICES FOR USE IN POWER SUPPLIES TO CONVERT A DC VOLTAGE TO ANOTHER DC VOLTAGE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A multichip assembly includes semiconductor devices or semiconductor device components with outer connectors on peripheral edges thereof. The outer connectors are formed by creating via holes along boundary lines between adjacent, unsevered semiconductor devices, or semiconductor device components, then plating or filling the holes with conductive material. When adjacent semiconductor devices or semiconductor device components are severed from one another, the conductive material in each via between the semiconductor devices is bisected. The semiconductor devices and components of the multichip assembly may have different sizes, as well as arrays of outer connectors with differing diameters and pitches. Either or both ends of each outer connector may be electrically connected to another aligned outer connector or contact area of another semiconductor device or component. Assembly in this manner provides a low-profile stacked assembly.