POLYMERS USED MANUFACTURE

Brand Owner (click to sort) Address Description
AGILIS CSP Technologies, Inc. 960 W. Veterans Blvd. Auburn AL 36832 Polymers used in the manufacture of packaging in the commercial, industrial, and pharmaceutical fields, specifically packaging that has been subjected to heat activating treatments;
CASATHANE Thomas Swan & Co. Ltd. Rotary Way Consett DH87ND United Kingdom Polymers used in the manufacture of coatings;
DERMACRYL AKZO NOBEL SURFACE CHEMISTRY 525 West Van Buren Street Chicago IL 60607 polymers used in the manufacture of skin care products;
FASTEX THE SHERWIN-WILLIAMS COMPANY 101 W. PROSPECT AVENUE CLEVELAND OH 441151075 polymers used in the manufacture of paints and coatings;
POLYALIPHATIC RESIN FRANKLIN INTERNATIONAL, INC. 2020 Bruck Street Columbus OH 43207 polymers used in the manufacture of glues and adhesives;
SHERMAX Sherwin-Williams Company,The 101 Prospect Avenue, NW Cleveland OH 441151075 polymers used in the manufacture of paints, coatings, stains, inks;
SHERNAD SHERWIN-WILLIAMS COMPANY, THE Cleveland OH polymers used in the manufacture of paints, coatings, stains, inks;
SHERNET SHERWIN-WILLIAMS COMPANY, THE Cleveland OH polymers used in the manufacture of paints, coatings, stains, inks;
SHERTEX SWIMC, INC. PO BOX 657 NEWARK DE 197150657 polymers used in the manufacture of paints, coatings, stains, inks;
VISCOPHOBE Union Carbide Corporation 7501 State Highway 185 North Seadrift TX 77983 polymers used in the manufacture of personal care products;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.