POLISHING PREPARATIONS ELECTRONIC EQUIPMENT

Brand	Owner	Address	Description
RODELENE	RODEL, INC.	221 HAWLEY ST. WILMINGTON DE 19805	polishing preparations for electronic equipment and silicone wafers;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A polishing pad used for polishing the surface of a semiconductor wafer in CMP equipment, includes a support layer adhered to the top of a rotary plate of the CMP equipment, a polishing layer disposed on top of the support layer, and an adhesive layer interposed between the support layer and the polishing layer and adhesively fixing the polishing layer to the support layer. In one embodiment, the polishing support layer is a plate-shaped molded article formed of a mixture including magnetic powder and a bonding agent containing synthetic resin. In another embodiment, a protective film extends along outer peripheral side walls of the adhesive layer and the support layer.