POLISHING PADS USE

Brand	Owner (click to sort)	Address	Description
FX9	FREUDENBERG NONWOVENS LIMITED PARTNERSHIP	3500 Industrial Drive Durham NC 27704	POLISHING PADS FOR USE IN SEMICONDUCTOR MANUFACTURING;F X 9;
PINNACLE	APPLIED MATERIALS, INC.	3050 Bowers Avenue Santa Clara CA 95054	Polishing pads for use in chemical-mechanical polishing (CMP);
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.