PLATING SOLUTION USEFUL FOR DEPOSITING

Brand	Owner	Address	Description
TECHNI-BLACK	TECHNIC, INC.	1 Spectacle Street Cranston RI 02910	PLATING SOLUTION USEFUL FOR DEPOSITING BLACK COATINGS ON BASE METAL;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A plating method is capable of depositing a plated film having excellent in-plane uniformity with respect to a thin seed layer and excellent embeddability with respect to fine damascene structures. The plating method includes: positioning an electric resistor between a conductive layer formed on at least a portion of a surface of a substrate and an anode; introducing respectively a plating solution into a space between the conductive layer and the anode on a conductive layer side, and an anode solution into a space between the conductive layer and the anode on an anode side, thereby filling the space with a plating bath composed of the plating solution and the anode solution, with the plating solution containing 25 to 75 g/L of copper ions and at least 0.4 mole/L of an organic acid or an inorganic acid, and the anode solution being of the same composition as the plating solution, or containing 0 to 75 g/L of copper ions and at most 0.6 mole/L of an organic acid or an inorganic acid; and applying a voltage between the conductive layer and the anode to plate a surface of the conductive layer.