PLASTIC PROFILE EXTRUSIONS FORM

Brand Owner (click to sort) Address Description
EXADECOR GROSFILLEX SAS Rue de Lac 20 F-01100 Arbent France Plastic profile extrusions to form the exposed layer of walls, floors, and ceilings; plastic panels to form the exposed layer of walls, floors and ceilings; plastic profile extrusions for use as cladding for exterior construction; plastic plates, namely, panels for use as cladding for exterior construction; non-metallic partitions, namely, wall sections; non-metallic wall tiles for construction purposes; non-metallic floor tiles;
EXASTYLE GROSFILLEX SAS Rue de Lac 20 F-01100 Arbent France Plastic profile extrusions to form the exposed layer of walls, floors, and ceilings; plastic panels to form the exposed layer of walls, floors and ceilings; plastic profile extrusions for use as cladding for exterior construction; plastic plates, namely, panels for use as cladding for exterior construction; non-metallic partitions, namely, wall sections; non-metallic wall tiles for construction purposes; non-metallic floor tiles;
GX PRO Grosfillex S.A.S. ARBENT F-01100 OYONNAX France PLASTIC PROFILE EXTRUSIONS TO FORM THE EXPOSED LAYER OF WALLS, FLOORS AND CEILINGS; PLASTIC LINING BOARDS, NAMELY, PANELS TO FORM THE EXPOSED LAYER OF WALL, FLOORS AND CEILINGS; NON-METAL BUILDING MATERIALS, NAMELY, PLASTIC WALL CLADDING; NON-METALLIC WALL TILES FOR CONSTRUCTION PURPOSES; FLOOR TILES NOT OF METAL;PRO;MOVEABLE PLASTIC OFFICE AND HOME PARTITIONS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Metal nitride and metal oxynitride extrusions often form on metal silicides. These extrusions can cause short circuits and degrade processing yields. The present invention discloses a method of selectively removing such extrusions. In one embodiment, a novel wet etch comprising an oxidizing agent and a chelating agent selectively removes the extrusions from a wordline in a memory array. In another embodiment, the wet etch includes a base that adjusts the pH of the etch to selectively remove certain extrusions relative to other substances in the wordline. Accordingly, new metal silicide structures can be used to form novel wordlines and other types of integrated circuits.