PLASTIC MOLDING COMPOUND USE

Brand Owner (click to sort) Address Description
EXSILCAP Utility Development Corporation 112 Naylon Avenue Livingston NJ 07039 Plastic molding compound for use in the encapsulation of integrated circuits;
KOFAL MITCHELL, PATRICK J 321 HIGH SCHOOL ROAD NE SUITE D3, PMB 324 BAINBRIDGE ISLAND WA 98110 plastic molding compound for use in the manufacture of molded plastic articles;
TCA TEIJIN AUTOMOTIVE TECHNOLOGIES, INC. 255 Rex Blvd. Auburn Hills MI 48326 plastic molding compound for use in the manufacture of molded plastic articles;
TCA CONTINENTAL STRUCTURAL PLASTICS, INC. 255 Rex Blvd. Auburn Hills MI 48326 plastic molding compound for use in the manufacture of molded plastic articles;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.