PLASTIC COMPOUND PRIMARILY COMPOSED

Brand Owner (click to sort) Address Description
HDPET NUCON CORPORATION 111 Pfingsten Road, Suite 160 Deerfield IL 600155616 plastic compound primarily composed of HDPE (high-density polyethelyne) and PET (polyethelyne-terephthalate) for use in manufacturing a wide variety of products;
HDPET MENASHA CORPORATION 1645 Bergstrom Road Neenah WI 54956 plastic compound primarily composed of HDPE (high-density polyethylene) and PET (polyethylene-terephthalate) for use in manufacture of molded plastic articles;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.