PLASMA DEVICES ETCHING

Brand Owner Address Description
ERIO APJet, Inc. 523 Davis Drive, Suite 100 Morrisville NC 27560 Plasma devices for etching and deposition of films on semiconductor wafers, textiles, glass and metals and for treating the surfaces of polymer films to increase adhesion;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. An apparatus and method are described for etching Ni-containing films using gas phase plasma etching. Etching of Ti-Ni alloys is carried out by exposure to plasma comprising hydrogen halide (HX) and carbonyl etching gases. The Ti in the Ti-Ni alloy is etched via an ion-assisted reaction with HX and the Ni is etched by reacting with CO. The method is particularly well suited for anisotropic etching of Ti-Ni metal gates for CMOS applications. Etching of Ni-Fe layers is carried out by exposure to plasma comprising a carbonyl etching gas.