PHOTONIC DEVICES

Brand Owner (click to sort) Address Description
CORETEK CoreTek, Inc. Suite 210 38505 Country Club Drive Farmington Hills MI 48331 photonic devices, namely, lasers and components thereof, light waveguides, light filters and modulators, electro-optical films and substrates for use in forming light-handling devices, photorefractive image processing devices and components thereof, fiberoptic light switches and fiberoptic light amplifiers;
LIGHTRIDER Mitel Corporation 400 March Road Kanata K2K 3H4 PHOTONIC DEVICES, NAMELY, MULTIPLEXERS AND DEMULTIPLEXERS, FOR USE IN OPTICAL NETWORKS;LIGHT RIDER;
LITELASER VIDEOJET TECHNOLOGIES INC. Legal Dept. 1500 Mittel Blvd. Wood Dale IL 60516 Photonic devices, namely, lasers for industrial cutting, etching and labeling;LIGHT LASER;
LITELASER LiteLaser Suite 340 39533 Woodward Avenue Bloomfield Hills MI 48304 Photonic devices, namely, lasers for industrial cutting, etching and labeling;LIGHT LASER;
MEM-TUNE CoreTek, Inc. Suite 210 38505 Country Club Drive Farmington Hills MI 48331 photonic devices, namely, lasers and components thereof, light waveguides, light filters and modulators, electro-optical films and substrates for use in forming light-handling devices, photo-refractive image processing devices and components thereof, fiberoptic light switches and fiberoptic light amplifiers;MEM TUNE;
OPTUN OPTUN LTD. P.O.Box 15017 22 Building Haifa 31095 Israel Photonic devices, modules, equipment, and sub-systems, namely optical switches, switching fabrics, variable optical attenuators, multiplexers, demultipexers interleavers, optical filters, light waveguides, for use in optical communications;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.