PACKAGES INTEGRATED CIRCUIT ASSEMBLIES

Brand	Owner (click to sort)	Address	Description
D L L	SHINKO DENKI KOGYO KABUSHIKI KAISHA	80, Oshimada-machi, Nagano-shi Nagano 381-2287 Japan	Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit;DLL;
DLL+	SHINKO DENKI KOGYO KABUSHIKI KAISHA	80, Oshimada-machi, Nagano-shi Nagano 381-2287 Japan	Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit;
DLL3	SHINKO DENKI KOGYO KABUSHIKI KAISHA	80, Oshimada-machi, Nagano-shi Nagano 381-2287 Japan	Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit;DLL THREE;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a mounting length determined in a first direction and a mounting width determined in a second direction, on at least one surface thereof, and a plurality of integrated circuit packages having a package mounting combination length longer than the mounting length of the wiring board. An embodiment may also have some packages among the plurality of integrated circuit packages mounted directly on the mounting space, while other packages are mounted indirectly on the mounting space. The present embodiment may have packages that are overlapped horizontally and vertically distant from one another. Embodiments allow a plurality of chips or packages to be mounted in a limited area without changing a form factor of integrated circuit module even when integrated circuit chip or package size increases.