PACKAGED FOOD COMBINATION CONSISTING PRIMARILY

Brand Owner (click to sort) Address Description
BAGEL DIPPERS KRAFT FOODS, INC. Three Lakes Drive Northfield IL 60093 packaged food combination consisting primarily of crackers or breadsticks;BAGEL;
FRENCH TOAST DIPPERS KRAFT FOODS, INC. Three Lakes Drive Northfield IL 60093 packaged food combination consisting primarily of crackers or breadsticks;FRENCH TOAST;
IT'S ALL IN THE BAG REAL EATS AMERICA INC. 122 North Genesee Street Geneva NY 14456 Packaged food combination consisting primarily of meat, meat substitutes, poultry, fish, seafood, cheese, and/or vegetables, processed beans, processed nuts and edible seeds, and also including sauces or seasonings; prepared food kits composed of meat, meat substitutes, poultry, fish, seafood, cheese and/or vegetables, processed beans, processed nuts and edible seeds, and also including sauces or seasonings;Food delivery;IT IS ALL IN THE BAG;subscriber-based meal planning services, accessible through the internet; food preparation services featuring meat, meat-substitutes, poultry, fish, seafood, cheese, pastas, rice, fruits, vegetables, seasonings or sauces;
POT-TO-PLATE REAL EATS AMERICA INC. 122 North Genesee Street Geneva NY 14456 Packaged food combination consisting primarily of meat, meat substitutes, poultry, fish, seafood, cheese, and/or vegetables, processed beans, processed nuts and edible seeds, and also including sauces or seasonings; prepared food kits composed of meat, meat substitutes, poultry, fish, seafood, cheese and/or vegetables, processed beans, processed nuts and edible seeds, and also including sauces or seasonings;food delivery;subscriber-based meal planning services, accessible through the internet; food preparation services featuring meat, meat-substitutes, poultry, fish, seafood, cheese, pastas, rice, fruits, vegetables, seasonings or sauces;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A VCSEL die is packaged so that its optical axis is at a predetermined non-perpendicular and nonparallel angle relative to the plane of a PCB to which the packaged die will be mounted. The die is packaged to form an emitting component which is shaped to orient the VCSEL optical axis at the predetermined angle when the component is placed onto a PCB. The component can be used in combination with a flip-chip sensor IC located on an opposite side of a PCB from the emitting component. The component can also be used in combination with a CSP sensor IC on the same side of a PCB. A VCSEL die and sensor IC can be contained in a single package. The optical axis of the VCSEL die packaged with a sensor IC may or may not be perpendicular to a plane of an array in the sensor IC.