OUT POST

Brand Owner (click to sort) Address Description
HOME OUTPOST Styleclick.com Inc. 3861 Sepulveda Boulevard Culver City CA 90230 HOME OUT POST;Electronic retailing services via a global computer network featuring home furnishings and accessories;HOME;
OUTPOST TOURELLE CHATEAU PICHON BARON PAUILLAC 33250 France OUT POST;WINE;
OUTPOST BAYER CORPORATION 100 Bayer Road Pittsburgh PA 15205 OUT POST;Non-metal containers for use with chemical insecticides for insertion in and around buildings and structures, to kill termites;
OUTPOST The Higgins Group Corp. 3198 N.W. 125th Street Miami FL 33167 OUT POST;bird food and small animal food;
OUTPOST OUTPOST WINES P.O. Box J Angwin CA 94508 OUT POST;WINE;
OUTPOST Carrot Seed Outpost Ventures 133 N. Jefferson St. 4th Floor Chicago IL 60661 THE OUT POST;Leasing and management of shopping centers;
OUTPOST Palo Alto Software, Inc. Suite 426 44 W. Broadway Eugene OR 97401 OUT POST;Software as a service (SAAS) services featuring software for managing, sorting, replying to, forwarding, deleting and storing emails, social media messages, and electronic messages; none of the foregoing services in the field of application security testing, compliance testing, vulnerability management, managed security services, scanning and penetration testing of computers and networks to assess information security vulnerability;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, attaching the resonator wafer to a base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, preparing a cap with backside metallization, and attaching a cap wafer on top of the base wafer. The present invention relates further to a gyroscope containing an integrated post with on or off-chip electronics.