NON METALLIC PREPARATIONS FILLING HOLES

Brand Owner (click to sort) Address Description
TETRION Tetrosyl Limited Bevis Green Works Bevis Green Bury BL9 6RE United Kingdom Non-metallic preparations for filling holes, dents, cracks, depressions and similar defects in surfaces such as walls, floors, and ceilings made of wood, plaster, brick, cement and concrete; grouting for tiles; grouting compositions with adhesive properties for tiles;Fillers and adhesive preparations used by decorators; fillers for plaster, brick, masonry, concrete and wood;
TETRION MICROLITE TECHNOLOGY Tetrosyl Limited Bevis Green Works Bevis Green Bury BL9 6RE United Kingdom non-metallic preparations for filling holes, dents, cracks, depressions and similar defects in surfaces such as walls, floors, and ceilings made of wood, plaster, brick, cement and concrete; grouting for tiles; grouting compositions with adhesive properties for tiles;fillers and adhesive preparations used by decorators; fillers for plaster, brick, masonry, concrete and wood;MICROLITE TECHNOLOGY;
TETRION SMART FILLER Tetrosyl Limited Bevis Green Works Bevis Green Bury BL9 6RE United Kingdom non-metallic preparations for filling holes, dents, cracks, depressions and similar defects in surfaces such as walls, floors, and ceilings made of wood, plaster, brick, cement and concrete; grouting for tiles; grouting compositions with adhesive properties for tiles;fillers and adhesive preparations used by decorators; fillers for plaster, brick, masonry, concrete and wood;FILLER;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A multilayer wiring board (11) is provided which includes a core substrate (12) including a plurality of through-holes (15). The through-holes (15) include through-hole conductors (17) on the inner walls of corresponding penetration holes (16) of a diameter of 200 ?m or less. Interlayer insulating layers (31, 32) are disposed on opposite sides of the principal planes (13, 14) of the core substrate (12). Wiring layers (23, 24) are disposed on the surface of interlayer insulating layers (31, 32). The through-holes (15) are filled with a hardened filling material (18). Lid conductors (21, 22) close the openings of the through-holes (15). The value of linear expansion of the hardened filling material (18) is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.