MICROWAVE CIRCUIT PACKAGES COMPRISING INTEGRATED

Brand	Owner	Address	Description
VIA/BGA	MICRO SUBSTRATES CORPORATION	2400 South Roosevelt Street Tempe AZ 85282	microwave circuit packages comprising integrated circuit chips mounted on substrates;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack are at least two integrated circuit chip packages. The integrated circuit chip packages may be electrically connected to the first conductive pattern of the flex circuit such that the integrated circuit chip packages are positioned upon respective ones of opposed top and bottom surfaces of the flex substrate. Alternatively, one of the integrated circuit chip packages may be positioned upon the top surface of the flex substrate and electrically connected to the first conductive pattern, with the remaining integrated circuit chip package being attached in a non-conductive manner to the bottom surface of the flex substrate such that the conductive contacts of such integrated circuit chip package and the leads collectively define a composite footprint for the chip stack.