MICROPROCESSOR CHIPS

Brand Owner (click to sort) Address Description
HYPERSTONE HYPERSTONE GMBH LINE-EID-STRASSE 3 KONSTANZ D78467 Germany MICROPROCESSOR-CHIPS, MICROCONTROLLER-CHIPS AND WORK-STATION COMPUTERS MADE FROM SUCH CHIPS;HYDER STONE;
HYPERSTONE HYPERSTONE AG. LINE-EID-STRASSE 3 D-78467 KONSTANZ Germany MICROPROCESSOR-CHIPS, MICROCONTROLLER-CHIPS AND WORK-STATION COMPUTERS MADE FROM SUCH CHIPS;HYDER STONE;
HYPERSTONE MULLER, OTTO 78465 KONSTANZ AM GUCKENBUHL 10 KONSTANZ Germany MICROPROCESSOR-CHIPS, MICROCONTROLLER-CHIPS AND WORK-STATION COMPUTERS MADE FROM SUCH CHIPS;HYDER STONE;
NIVEN BITFURY IP B.V. Strawinskylaan 3051 NL-1077 ZX Amsterdam Netherlands Microprocessor chips; chipsets; computer chips; semiconductor chips; electronic components for computers; replacement and structural parts for all of the aforesaid goods;
PA-RISC POWERED HEWLETT-PACKARD COMPANY 3000 Hanover Street Palo Alto CA 94304 microprocessor chips, computer hardware and user manuals supplied therewith;
R3000 IMAGINATION TECHNOLOGIES 3201 SCOTT BLVD. SANTA CLARA CA 95054 MICROPROCESSOR CHIPS;R-3000;
R4/050 MIPS COMPUTER SYSTEMS, INC. 930 ARQUES AVENUE SUNNYVALE CA 940863650 microprocessor chips;
R4/500 MIPS COMPUTER SYSTEMS, INC. 930 ARQUES AVENUE SUNNYVALE CA 940863650 microprocessor chips;R4 500;
R4/900 MIPS COMPUTER SYSTEMS, INC. 930 ARQUES AVENUE SUNNYVALE CA 940863650 microprocessor chips;R 4 900;
R4000 MIPS TECHNOLOGIES, INC. 955 East Arques Avenue Sunnyvale CA 940854521 microprocessor chips;R-4000;
R4000 MIPS COMPUTER SYSTEMS INC. 950 De Guigne Drive Sunnyvale CA 94086 microprocessor chips;R-4000;
R4200 MIPS TECHNOLOGIES, INC. 955 East Arques Avenue Sunnyvale CA 940854521 microprocessor chips;
R5000 MIPS COMPUTER SYSTEMS, INC. 930 ARQUES AVENUE SUNNYVALE CA 940863650 microprocessor chips;
R6000 MIPS COMPUTER SYSTEMS, INC. 930 ARQUES AVENUE SUNNYVALE CA 940863650 MICROPROCESSOR CHIPS;
SEESAW Limor Fried, DBA Adafruit Industries 150 Varick Street, 3rd Floor New York NY 10013 Microprocessor chips;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requirements and some of the chips are thinned to insure that the chips requiring the lowest thermal resistance has the thinnest layer of a thermal adhesive or metal or solder interface between the chip and thermal spreader.