MICROELECTRONIC SEMICONDUCTOR DEVICES

Brand Owner (click to sort) Address Description
AVIATION WHITE MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic Semiconductor Devices;
DIGITAL D MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic Semiconductor Devices;DIGITAL;
GIGAMITE MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices;
ISOBLOCK MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices;
LX1701 MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices;
PANELMATCH MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices;PANEL MATCH;
SHARPKNEE MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 MICROELECTRONIC SEMICONDUCTOR DEVICES;SHARP KNEE;
SUPERSOFT MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic Semiconductor Devices;SUPER SOFT;
SUPERSTACK MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices; namely, an assembly of multiple diodes for use in power control for industrial systems;SUPER STACK;
TRANSIENT CORRECTION MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices;
WAVE FUNCTIONS MICROSEMI CORPORATION One Enterprise Aliso Viejo CA 92656 Microelectronic semiconductor devices;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Microelectronic devices with improved heat dissipation, methods of making microelectronic devices, and methods of cooling microelectronic devices are disclosed herein. In one embodiment, the microelectronic device includes a microelectronic substrate having a first surface, a second surface facing opposite from the first surface, and a plurality of active devices at least proximate to the first surface. The second surface has a plurality of heat transfer surface features that increase the surface area of the second surface. In another embodiment, an enclosure having a heat sink and a single or multi-phase thermal conductor can be positioned adjacent to the second surface to transfer heat from the active devices.